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IS43TR16128BL-125KBLI 2GB DYNAMIC RANDOM ACCESS MEMORY BGA-96

Categories SRAM Chip
Brand Name: ISSI
Model Number: IS43TR16128BL-125KBLI
Certification: ROSH
Place of Origin: TWN
MOQ: 1
Price: consult
Payment Terms: T/T,Western Union
Supply Ability: 10000
Delivery Time: 5-8DAY
Packaging Details: T/R
Data Width: 8-bit
Package Type: SOIC-28
Subcategory: Memory & Data Storage
Capacity: 1GB
Memory Type: DDR4 SDRAM
Access Time: 10ns
Manufacturer: Example Semiconductor Inc.
Working Voltage: 2.7 V to 3.6 V
Speed: DDR4-2400
Application: Cache memory, buffer storage
Installation Method: Surface mount installation
Operating Temperature: 0°C to 85°C
Operating Frequency: 100MHz
Refresh Count: 8K
Interface: SATA III
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IS43TR16128BL-125KBLI 2GB DYNAMIC RANDOM ACCESS MEMORY BGA-96

IS43/46TR16128B, IS43/46TR16128BL,IS43/46TR82560B, IS43/46TR82560BL

256Mx8, 128Mx16 2Gb DDR3 SDRAM

FEATURES
  • Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V
  • Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V - Backward compatible to 1.5V
  • High speed data transfer rates with systemfrequency up to 1066 MHz
  • 8 internal banks for concurrent operation
  • 8n-Bit pre-fetch architecture
  • Programmable CAS Latency
  • Programmable Additive Latency: 0, CL-1,CL-2
  • Programmable CAS WRITE latency (CWL) basedon tCK
  • Programmable Burst Length: 4 and 8
  • Programmable Burst Sequence: Sequential orInterleave
  • BL switch on the fly
  • Auto Self Refresh(ASR)
  • Self Refresh Temperature(SRT)
  • Refresh Interval:
    • 7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C
    • 3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C
  • Partial Array Self Refresh
  • Asynchronous RESET pin
  • TDQS (Termination Data Strobe) supported (x8only)
  • OCD (Off-Chip Driver Impedance Adjustment)
  • Dynamic ODT (On-Die Termination)
  • Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω)
  • Write Leveling
  • Up to 200 MHz in DLL off mode
  • Operating temperature:
    • Commercial (TC = 0°C to +95°C)
    • Industrial (TC = -40°C to +95°C)
    • Automotive, A1 (TC = -40°C to +95°C)
    • Automotive, A2 (TC = -40°C to +105°C)
OPTIONS
  • Configuration:
    • 256Mx8
    • 128Mx16
  • Package:
    • 96-ball BGA (9mm x 13mm) for x16
    • 78-ball BGA (8mm x 10.5mm) for x8
ADDRESS TABLE
Parameter256Mx8128Mx16
Row AddressingA0-A14A0-A13
Column AddressingA0-A9A0-A9
Bank AddressingBA0-2BA0-2
Page size1KB2KB
Auto PrechargeAddressingA10/APA10/AP
BL switch on the flyA12/BC#A12/BC#
SPEED BIN
Speed Option15H125K107M093NUnits
JEDEC Speed GradeDDR3-1333HDDR3-1600KDDR3-1866MDDR3-2133N
CL-nRCD-nRP9-9-911-11-1113-13-1314-14-14tCK
tRCD,tRP(min)13.513.7513.9113.09ns

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