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| Categories | Ceramic PCB Board |
|---|---|
| Copperthickness: | 18µm - 105µm |
| Item No: | R0028 |
| Thickness: | 0.1mm - 3.0mm |
| Productname: | Ceramic PCB Board |
| Surfacefinish: | ENIG, HASL, Gold Plating |
| Substratetype: | Ceramic |
| Layercount: | 1-4 Layers |
| Type: | Ceramic Thickfilm PCB |
| Company Info. |
| LT CIRCUIT CO.,LTD. |
| Verified Supplier |
| View Contact Details |
| Product List |
The Ceramic PCB Board, item number R0028, represents an advanced solution in the realm of printed circuit boards, designed specifically to meet the demanding requirements of modern electronic applications. With a standard PCB thickness of 1.6 MM and customizable sizes ranging from 2mm up to 200mm, this product offers remarkable versatility and precision to accommodate a wide variety of design specifications and project needs.
One of the hallmark features of this Ceramic PCB Board is its exceptional heat dissipation capability. Engineered using high-quality ceramic materials, it boasts high thermal conductivity Ceramic PCBs characteristics that significantly enhance the efficiency and reliability of electronic devices. This property is crucial in applications where heat management is vital to maintain optimal performance and prevent component failure. The ceramic substrate efficiently transfers heat away from sensitive electronic components, ensuring prolonged lifespan and stable operation under high-temperature conditions.
The Ceramic PCB Board is certified by internationally recognized quality management and environmental standards, including ISO9001, ISO14001, IATF16949, and UL. These certifications underscore the product’s commitment to excellence in manufacturing quality, environmental responsibility, and safety compliance. Customers can trust that each board meets stringent quality controls and performs consistently even in the most challenging environments.
High thermal conductivity Ceramic PCBs like this one are increasingly sought after in industries such as automotive electronics, telecommunications, LED lighting, power modules, and aerospace. The ceramic material's superior thermal properties provide a significant advantage over traditional PCB materials like FR4, particularly in applications involving high power density and thermal stress. This Ceramic PCB Board enables designers and engineers to develop more compact, efficient, and reliable electronic systems by effectively managing heat dissipation.
Moreover, the product's size flexibility from as small as 2mm to as large as 200mm allows it to be tailored for microelectronics as well as larger, more complex circuitry. The 1.6 MM thickness provides a robust yet manageable structure that integrates well with various assembly processes and component mounting techniques. This adaptability makes the Ceramic PCB Board an excellent choice for prototyping as well as mass production.
In summary, the R0028 Ceramic PCB Board offers a premium combination of high thermal conductivity, precise sizing options, and certified quality standards. Its ability to efficiently conduct heat away from critical components makes it a preferred choice for high-performance electronics requiring reliable thermal management. By incorporating this product into your designs, you benefit from enhanced durability, improved thermal performance, and compliance with key industry certifications.
Whether you are developing cutting-edge LED modules, automotive control units, or high-frequency communication devices, the high thermal conductivity Ceramic PCBs embodied in this product ensure superior thermal management and electrical insulation. This translates to better system stability, reduced thermal fatigue, and overall enhanced device longevity.
Choosing the Ceramic PCB Board, item no. R0028, means investing in a product that combines innovation, quality, and functionality. It is a strategic component that empowers engineers and manufacturers to push the boundaries of electronic design, delivering solutions that meet the evolving demands of today’s technology-driven world. Experience the benefits of high thermal conductivity Ceramic PCBs and elevate your electronic assemblies to new levels of performance and reliability.
| Item No | R0028 |
| Surface Finish | ENIG, HASL, Gold Plating |
| Type | Ceramic Thickfilm PCB |
| Product Name | Ceramic PCB Board |
| Application | High Power Electronics, LED Lighting, RF Modules |
| Dielectric Constant | 7-9 |
| PCB Thickness | 1.6 MM |
| Substrate Type | Ceramic |
| Thickness | 0.1mm - 3.0mm |
| Layer Count | 1-4 Layers |
The Ceramic PCB Board, available in 1 to 4 layers, is specifically designed to meet the demanding requirements of high power electronics, LED lighting, and RF modules. Its robust construction and advanced materials make it an ideal choice for applications requiring excellent thermal management and electrical performance. The board’s thickness of 1.6 mm, combined with copper thickness options ranging from 18µm to 105µm, ensures durability and effective current-carrying capacity, catering to various power and signal needs.
One of the standout features of this product is its use of Ceramic Glass Composite PCB technology, which provides enhanced mechanical strength and superior heat dissipation. This is critical in high power electronics where overheating can lead to performance degradation or failure. Additionally, the Ceramic Copper Clad PCB design ensures reliable conductivity and stability even under extreme operating conditions, making it suitable for high-frequency RF modules and advanced LED lighting systems.
Moreover, the Ceramic PCB Board boasts an impressive thermal conductivity rating of 170W/m·K ALN Ceramic PCBs, allowing efficient heat transfer away from sensitive components. This thermal efficiency supports the longevity and reliability of devices in sectors such as telecommunications, automotive electronics, and industrial power supplies.
The product is manufactured in compliance with internationally recognized standards, holding certifications including ISO9001, ISO14001, IATF16949, and UL. These certifications guarantee that the Ceramic PCB Board meets stringent quality, environmental, and safety requirements, making it a trustworthy component for critical and high-performance electronic applications.
In practical scenarios, this Ceramic PCB Board is widely used in LED lighting fixtures, where consistent light output and thermal management are crucial. It is also employed in RF modules that demand stable signal transmission and heat resistance. Furthermore, high power electronic devices such as power converters and amplifiers benefit from the board’s superior electrical and thermal characteristics.
In summary, the Ceramic PCB Board with its multi-layer options, certified quality, and advanced material composition, including Ceramic Glass Composite PCB and Ceramic Copper Clad PCB technologies, stands out as a reliable and high-performance solution for modern electronic applications requiring exceptional thermal management and electrical integrity.
Our Ceramic PCB Board customization services cater to a wide range of requirements, offering sizes from 2mm to 200mm to perfectly fit your project needs. Specially designed for high power electronics, LED lighting, and RF modules, our Ceramic Substrate PCB solutions ensure exceptional performance and reliability. We manufacture high-quality Ceramic Printed Circuit Boards using Al2O3 Ceramic PCBs materials, providing a dielectric constant ranging from 7 to 9 for optimal electrical insulation and thermal management. Certified to ISO9001, ISO14001, IATF16949, and UL standards, our products meet stringent quality and safety requirements, making them ideal for demanding applications. Trust our customized Ceramic PCB Boards to deliver superior durability and efficiency tailored to your specifications.
Our Ceramic PCB Boards are designed to offer superior thermal conductivity, exceptional mechanical strength, and excellent electrical insulation properties. For optimal performance and longevity, please follow the recommended handling and usage guidelines.
When soldering components onto the Ceramic PCB Board, use temperature-controlled soldering equipment to prevent damage caused by excessive heat. It is advisable to use soldering temperatures not exceeding 350°C and limit the soldering duration to a maximum of 10 seconds per joint.
Cleaning of the Ceramic PCB Board should be performed using isopropyl alcohol or other non-abrasive cleaning agents. Avoid using water or aqueous solutions that may penetrate the board and affect its insulating properties.
During assembly, ensure that mechanical stresses are minimized. Ceramic substrates are more brittle compared to traditional FR4 boards, so handle with care to avoid cracking or chipping.
If you encounter any issues with your Ceramic PCB Board, such as delamination, cracking, or electrical failures, please refer to the product datasheet for troubleshooting tips and common failure modes. Proper storage in a dry, temperature-controlled environment is essential to maintain board integrity.
For custom design support, thermal management solutions, or technical consultation regarding Ceramic PCB Boards, our engineering team is available to assist with your specific application requirements.
We are committed to providing high-quality Ceramic PCB Boards and support services to ensure your project's success. Please adhere to all recommended guidelines and contact our technical support team for further assistance.
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