Microfocus X-Ray Inspection System Enclosed X-ray Tube and Intuitive Operation

Industrial SMT PCB defect detection system – with automated batch inspection – offering high-precision imaging for BGA solder voids and PCB through-holes

• Programmable inspection processes to enable automated batch inspection
• New-generation 5-inch high-definition digital flat panel detector (FPD)
• Auto-navigation window – the worktable moves to the clicked position
• 420×420mm work table with a 15KG maximum load capacity
• Multi-angle inspection is available via optional 360° rotary jig
• Enclosed X-ray tube with over 10,000 hours of operational life, requiring no maintenance
• The system features intuitive operation, with only 2 hours of training required for use
• A 3-axis linkage system enables adjustment of movement speed

Working Principle

X6000 X-ray inspection system working principle

Full keyboard and mouse control for all functions, including X-ray tube activation and parameter adjustment.

Comprehensive measurement functions including distance, angle, radius, perimeter, and distance rate calculations for through-hole soldering analysis.

Three modes available: manual point setting, array pattern for regular points, and automatic feature recognition to enable efficient batch processing.

Adjustable brightness, contrast, and gain to achieve optimal image quality. Save and retrieve inspection parameters for repeated inspections.

Automatically calculates solder ball voids rate area and circumference and identifies defects supports manual void marking and parameter saving for consistent results.

X6000 inspection application example 1

X6000 inspection application example 2