Precision Molded Conductive PC Waffle Pack Chip Tray for Semiconductor Die Storage

Precision Molded Conductive Waffle Pack Chip Trays For Semiconductor Die Storage

This foundational product in microelectronic packaging is a high-precision waffle pack chip tray engineered in the industry-standard 4-inch format. It is expertly designed to provide a secure and reliable environment for the storage, handling, and transportation of fragile semiconductor bare die and chip-scale packages (CSPs). The tray features a uniform pocket matrix that is precision-molded to offer optimal support for 2.5D components, minimizing contact with sensitive surfaces. Material selection is paramount for microelectronics; thus, this waffle pack is constructed from a specialized electrically conductive plastic. This material choice is crucial as it guarantees essential electrostatic discharge (ESD) protection, safeguarding components from damage caused by static electricity. Furthermore, the robust, durable construction ensures exceptional rigidity and maintains dimensional stability, which is vital for maintaining component alignment throughout various handling stresses. Its compact footprint makes it an ideal solution for small-format devices where larger JEDEC matrix trays are not practical. This tray series is an essential, high-quality component supporting various back-end processes in microelectronic manufacturing, testing, and inspection workflows, adapting seamlessly from manual handling to semi-automated production lines. The focus of this design is on reliability and protection in a small-scale, widely accepted format.

Features:

• Compact 4-Inch Standard Footprint
• Precision-Molded Conductive Polymer
• Unparalleled Part Stability and Alignment
• Customization for Irregular Geometries
• Enhanced Compatibility and Handling
• Process Adaptability (Heat-Resistant Options)

Technical Parameters:

Applications:

The 4-inch conductive waffle pack tray is optimized for use throughout critical back-end microelectronic processes. Its primary applications include the secure handling and transport of: Bare Semiconductor Die (Silicon), Chip-Scale Packages (CSPs), and Small Photonic/Optical Elements that require precise alignment.

Customization:

We provide comprehensive customization services to ensure the waffle pack perfectly matches your device and process requirements. Full control over the pocket design is available, allowing for precise engineering of features such as chamfers, tapered walls, or clearance cuts to optimize the tray for automated pick-and-place operations and tool handling. For sensitive components, we can tailor the internal pocket geometry to provide terminal isolation or pad protection, ensuring no critical surface contacts the tray. Beyond geometry, material customization is key: trays can be molded in specific conductive materials (including black or color-coded ESD-safe resins) or in high-temperature, bakeable plastics to accommodate specific thermal profiles needed for testing or drying.