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300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

Categories Laser PCB Depaneling Machine
Brand Name: Winsmart
Model Number: SMTL300
Certification: CE
Place of Origin: China
MOQ: 1 set
Price: USD1-150K/set
Payment Terms: L/C,T/T,Western Union
Supply Ability: 100 sets per month
Delivery Time: 5-30 days
Packaging Details: Plywood case
PCB Material: FR4 FPC
Laser Source: 25W UV
Working Table: 300x300mm, dual tables
Fixture: Customized
Wavelength: 355nm
Name: UV Laser PCB Depaneling Machine
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300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine


UV Laser PCB Depaneling Machine Overview:

A UV Laser PCB Depaneling Machine is a high-precision system used to separate (depanel) individual printed circuit board units from a larger panel without mechanical stress or contamination. The 300mm × 300mm working area makes this machine suitable for medium-sized PCBs used in mobile devices, medical devices, automotive electronics, and more.
Unlike traditional depaneling methods (e.g., routing, punching, or V-cutting), this machine uses a UV laser to cleanly and accurately cut through PCB substrates (FR4, polyimide, etc.) with no mechanical contact, ensuring no stress, no dust, and no delamination.



UV Laser PCB Depaneling Machine Features:

300×300mm Working Area: Supports medium-sized PCB panels with high flexibility.

UV Laser Cutting: Uses a 355 nm UV laser for high-precision, low-thermal-impact cutting.
No Mechanical Stress: No contact means no micro-cracks or component damage during depaneling.
Dust-Free Operation: No routing or sawing = zero dust and no need for post-cleaning.
High Precision & Accuracy: Cutting accuracy typically ±10 μm or better.
Vision System: CCD camera for fiducial recognition and dynamic alignment.
Programmable Cut Paths: Supports DXF/Gerber file import for complex board outlines.
Low Heat-Affected Zone (HAZ): UV laser minimizes thermal stress and carbonization.
Safety Enclosure: Fully enclosed design with laser shielding and interlock protection.
Auto Mark Alignment: Ensures perfect alignment for repeated, precision cuts.

UV Laser PCB Depaneling Machine Specifications:

ModelSMTL300, dual tables
Power380V AC, 50Hz, 20A
Compressed AirCompressed air
Machine Dimension1450(L)x1350(W)x1665(H)mm
Installation Space3000x3000x2500mm
Machine Weight800kgs
Ambient Temperature22 ~ 25 ℃
temperature variationwithin ± 1 ℃ / 24hr
ambient humiditywithin 40% ~ 70% (no obvious condensation is allowed)
Dust free grade100000 or better
power consumption6KW
Cutting width≤ 50mm × 50mm
Cutting materialsfull cut / half cut of PCB / FPC, LCP / glue and other related materials
Cutting thickness≤ 3mm
Cutting speed≤ 3000mm / S
Overall machining accuracy≤ 30um
Processing patternstraight line, slash, curve, abnormity, etc
Laser355nm light wave nanosecond laser
Repetition frequency50-150khz
Laser PowerUV 15W@30KHz
Pulse width< 20ns
Energy stability< 3% RMS over 8hours
Beam quality m ²< 1.3
Mode2500mm/S
Warranty1 year
ServiceOversea training is available

UV Laser PCB Depaneling Machine Advantages:

UV Laser PCB Depaneling Machine is a high-precision, non-contact depaneling solution designed for cutting, drilling, and marking printed circuit boards (PCBs). It is widely used in electronics, medical devices, automotive, aerospace, and telecommunications industries where high precision and minimal stress are required.

It is used in PCB depaneling due to its short wavelength (355nm) and high absorption efficiency in PCB materials like FR4, polyimide, ceramics, and aluminum-backed substrates. This ensures clean, precise cuts with minimal thermal impact.


UV Laser PCB Depaneling Machine Applications:

Smartphone and tablet PCBs
Wearable device electronics (smartwatches, fitness bands)
Medical and implantable devices
Automotive ADAS and infotainment boards
High-density rigid-flex PCBs
LED panel and lighting module depaneling


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