Nanoscale 3D Xray Inspection Equipment For PCBA Boards CE Certified

1.Equipment characteristics:
2D/2.5D imaging can achieve multi-axis linkage imaging function for ROI;
With imaging enhancement function; With automatic analysis function;
With image analysis function; With scanning programming function;
Optional rotating disk imaging module for more Angle observation;
3D imaging detection is realized for local devices on the whole board.
For small devices, optional turntable and cone-beam CT imaging functions are available.

2.Detection application:
Large size PCBA board
Internal structural quality of semiconductor packaging products
SMT welding quality of various types of solder joints, such as open welding, whether there is infiltration, solder amount, offset, foreign body, bridge, pin and so on

3.Basic Parameters

X-ray Source Parameters

Detector parameter

Equipment Performance Parameters Details

Wellman, a professional X-Ray inspection manufacturer which is integrates R&D, production and sales that is set up in China by Hong Kong-invested enterprises. 

Wellman has many years of professional R&D team at home and abroad, has been committed to the global intelligent manufacturing equipment industry to provide micro-focus X-ray image detection equipment, casting process detection equipment, lithium battery reliability and safety detection equipment and special non-standard automation equipment one-stop service program.

Our headquarters locates in Shenzhen, since 2003, mainly engaged in automation technology, software technology and big data technology R&D, with more than 30 national patents and software copyright.