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Rogers RO3210 PCB 0.6mm Thick with White Silkscreen

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-052.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Rogers RO3210
Layer count: 2-layer
PCB thickness: 0.6mm
PCB size: 54.5mm x 50mm
Copper weight: 1oz (equivalent to 1.4 mils or 35μm)
Surface finish: Immersion Gold
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Rogers RO3210 PCB 0.6mm Thick with White Silkscreen

Rogers RO3210 PCB 0.6mm Thick with White Silkscreen

This PCB is a high-performance 2-layer rigid board crafted from Rogers RO3210 material, designed to meet strict electrical and mechanical standards. It is ideally suited for applications that demand low-loss, high-frequency performance, such as 5G communication infrastructure etc.


1. PCB Specifications

ParameterValue
Base MaterialRogers RO3210 (ceramic-filled, woven fiberglass-reinforced PTFE laminate)
Layer Count2-layer (rigid structure)
Board Dimensions54.5mm x 50mm per piece, with a tolerance of ±0.15mm
Minimum Trace/Space5 mils (trace) / 8 mils (space)
Minimum Hole Size0.3mm
ViasNo blind vias; all vias feature a plating thickness of 20 μm
Finished Board Thickness0.6mm
Finished Copper Weight1oz (equivalent to 1.4 mils) for outer layers (Copper_layer_1 and Copper_layer_2)
Surface FinishImmersion Gold (ensures excellent solderability and corrosion resistance)
SilkscreenWhite silkscreen on the top layer; no silkscreen on the bottom layer
Solder MaskBlue solder mask on the top layer; no solder mask on the bottom layer
Quality Assurance100% electrical testing conducted prior to shipment to ensure functional integrity

2. PCB Stack-up Configuration

Layer NameMaterialThickness
Top Layer (Copper_layer_1)35 μm thick copper35 μm (1oz finished copper weight)
Core LayerRogers RO32100.508mm (20mil)
Bottom Layer (Copper_layer_2)35 μm thick copper35 μm

3. Artwork and Quality Standards

Artwork Format: Gerber RS-274-X (the industry-standard format for PCB manufacturing, ensuring compatibility with most fabrication equipment)


Quality Standard: Complies with IPC-Class-2 (meets high reliability requirements for commercial and industrial applications)


Availability: Globally available, supporting global project requirement.



4. Introduction to Rogers RO3210 Base Material

Rogers' RO3210 is a premium high-frequency circuit material engineered for demanding applications. It is a ceramic-filled laminate reinforced with woven fiberglass, combining two key advantages: the surface smoothness of non-woven PTFE laminates (enabling finer line etching) and the rigidity of woven-glass PTFE laminates (enhancing handling and durability). Critically, RO3210 can be fabricated into PCBs using standard PTFE circuit board processing techniques, simplifying manufacturing without compromising performance.


5. Key Features of RO3210 Material

PropertyValueSignificance
Dielectric Constant (Dk)10.2 ± 0.5Stable across frequency ranges, ideal for high-frequency signal integrity
Dissipation Factor0.0027 at 10GHzExtremely low, minimizing signal loss in high-frequency applications
Coefficient of Thermal Expansion (CTE)x-axis: 13 ppm/°Cy-axis: 13 ppm/°Cz-axis: 34 ppm/°CMatched to copper, reduces thermal stress during assembly and operation
Decomposition Temperature (Td)500 °C (TGA)Ensures stability at high temperatures during soldering and harsh operating conditions
Thermal Conductivity0.81 W/mKEnables efficient heat dissipation, protecting components from overheating
FlammabilityComplies with UL 94 V0 standardHigh fire resistance, enhancing safety in various environments

6. Benefits of RO3210 Material (and the PCB)

The use of RO3210 translates to multiple advantages for the PCB, making it suitable for high-performance applications:


Woven Glass Reinforcement: Improves rigidity, making the PCB easier to handle during manufacturing, assembly, and installation.


Uniform Electrical and Mechanical Performance: Ensures consistency across the board, making it ideal for complex multi-layer high-frequency structures.


Low In-Plane Expansion Coefficient (Matched to Copper):

Suitable for hybrid designs with epoxy multi-layer boards (enabling integration into larger systems).


Supports reliable surface-mounted assemblies (reducing the risk of solder joint failure due to thermal mismatch).


Excellent Dimensional Stability: Minimizes warpage or distortion during manufacturing and operation, leading to high production yields and long-term reliability.


Surface Smoothness: Allows for finer line etching tolerances (supporting the PCB’s 5/8 mils trace/space requirement) and precise component placement.


7. Typical Applications

- Automotive collision avoidance systems

- Automotive global positions satellite antennas

- Wireless telecommunications systems

- Microstrip patch antennas for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

- LMDS and wireless broadband

- Base station infrastructure


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