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Rogers TMM10i PCB 30mil Substrate 1OZ Copper

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-052.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Rogers TMM10i
Layer count: 2-layer
PCB thickness: 0.8mm
PCB size: 70mm x 75mm
Copper weight: 1oz (equivalent to 1.4 mils or 35μm)
Surface finish: Immersion tin
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Rogers TMM10i PCB 30mil Substrate 1OZ Copper

Rogers TMM10i PCB 30mil Substrate 1OZ Copper

This double-sided (2-layer) rigid PCB is built with Rogers TMM10i, an isotropic thermoset microwave composite optimized for high-reliability RF and microwave applications.


1. PCB Specifications

ParameterSpecification
Base MaterialRogers TMM10i (ceramic thermoset polymer composite)
Layer ConfigurationDouble-sided (2-layer, no blind vias—simplifies fabrication and reduces defects)
Board Dimensions70mm x 75mm per unit (tolerance: ±0.15mm for consistent assembly fit)
Minimum Trace/Space6/4 mils (enables dense routing for compact RF/microwave designs)
Minimum Hole Size0.3mm (supports miniaturized thru-hole components and precise via placement)
Finished Board Thickness0.8mm (thin-profile for space-constrained applications like antennas)
Finished Copper Weight1oz (1.4 mils, 35μm per outer layer—balances conductivity and design flexibility)
Via Plating Thickness20μm (enhances thru-hole reliability and current-carrying capacity)
Surface FinishImmersion tin (delivers corrosion resistance, low contact resistance, and excellent solderability)
Silkscreen (Top/Bottom)No / No (optimized for unobstructed signal paths in high-frequency circuits)
Solder Mask (Top/Bottom)No / No (avoids dielectric interference in microwave applications)
Quality Assurance100% electrical testing prior to shipment (eliminates open circuits/shorts)

2. PCB Stac-kup

Layer/ComponentSpecification
Copper Layer 135μm (1oz)
Rogers TMM10i Core0.762mm (30mil)
Copper Layer 235μm (1oz)


3. Quality Standards

Artwork Format: Gerber RS-274-X


Quality Certification: IPC-Class-2


Global Availability: Supplied worldwide to support international projects


4. Rogers TMM10i Material: Key Attributes

TMM10i is a ceramic thermoset composite that merges ceramic’s dielectric stability with PTFE’s processability, ideal for microwave and RF circuits:


Core Features

FeatureSpecification
Dielectric Constant (Dk)9.80 ± 0.245 (isotropic—consistent across all axes for predictable signal behavior)
Dissipation Factor (Df)0.0020 at 10GHz (ultra-low for minimal signal loss in high-frequency circuits)
Thermal Coefficient of Dk-43 ppm/°K (stable dielectric properties across temperature fluctuations)
CTE (x/y/z)19ppm/K, 19ppm/K, 20ppm/K (matched to copper—reduces thermal stress and delamination)
Decomposition Temperature (Td)425°C (high thermal stability for harsh environments)
Thermal Conductivity0.76 W/mK (efficient heat transfer for power amplifiers and high-power circuits)
Thickness Range0.0015–0.500 inches (±0.0015”)—flexible for custom design needs

5. Key Benefits

-Mechanical Durability: Resists creep and cold flow, ensuring long-term structural stability.


-Chemical Resistance: Withstands process chemicals, reducing damage during fabrication.


-Simplified Plating: No sodium napthanate treatment required prior to electroless plating—lowers production costs.


-Reliable Wire-Bonding: Thermoset resin base enables secure wire-bond connections for high-frequency components.


6. Typical Applications

This PCB is optimized for applications demanding stable dielectric performance and high reliability:


-RF and microwave circuitry (e.g., signal amplifiers, oscillators)

-Power amplifiers and combiners (high thermal conductivity supports heat management)

-Filters and couplers (isotropic Dk ensures precise signal filtering)

-Satellite communication systems (resists harsh environmental conditions)

-Global Positioning Systems (GPS) Antennas (stable Dk for accurate signal reception)

-Patch Antennas (thin profile and low Df enhance antenna efficiency)

-Dielectric polarizers and lenses (consistent Dk for lightwave control)

-Chip testers (reliable thru-holes support repeated component testing)


Conclusion

This double-sided TMM10i PCB delivers the precision, stability, and durability required for high-frequency RF and microwave applications. It is a trusted solution for engineers seeking to optimize performance in circuits like antennas, power amplifiers, and satellite communications systems.


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