RO3003 PCB Double-Layer 50mil Rogers Laminate 1OZ RF Circuit Board

This 2-layer rigid printed circuit board (PCB) is tailored for high-performance commercial microwave and RF applications, capitalizing on the outstanding properties of Rogers RO3003 ceramic-filled PTFE composite laminates. It provides stable electrical performance across a broad spectrum of temperatures and frequencies, rendering it a dependable option for crucial systems such as automotive radar, 5G mmWave infrastructure, and advanced driver assistance systems (ADAS).

1. PCB Specifications

The PCB’s construction is optimized for precision, reliability, and compatibility with high-frequency design requirements, with key details outlined in the table below:

2. PCB Stack-up Configuration

The 2-layer stack-up is designed to maximize the performance of the Rogers RO3003 substrate, ensuring stable signal propagation and structural integrity:

3. Standards & Global Accessibility

This PCB adheres to industry-leading standards and is readily available worldwide, ensuring consistency and convenience for global customers:

Artwork Format: Gerber RS-274-X (the industry-standard format for PCB manufacturing, compatible with all major design software and fabrication equipment)

Accepted Quality Standard: IPC-Class-2 (meets rigorous requirements for performance, reliability, and consistency in commercial and industrial applications, including thermal cycling and environmental durability)

Availability: Globally accessible (no regional restrictions, ensuring timely delivery for projects worldwide)

4. Rogers RO3003 Substrate: Key Details, Features & Benefits

The PCB’s exceptional performance is rooted in the superior properties of the Rogers RO3003 laminate—a ceramic-filled PTFE composite tailored for high-frequency applications.

4.1 Introduction to Rogers RO3003

Rogers RO3003 is a high-frequency laminate designed for commercial microwave and RF systems. It eliminates the typical "step change" in dielectric constant (Dk) near room temperature that plagues standard PTFE glass materials, ensuring consistent performance across operational conditions.

4.2 Critical Material Features

RO3003’s features are optimized for high-frequency reliability and stability:

Material Composition: Ceramic-filled PTFE composite (balances low loss and mechanical strength)

Dielectric Constant (Dk): 3 ± 0.04 at 10 GHz / 23°C (tight tolerance for predictable signal behavior)

Dissipation Factor: 0.001 at 10 GHz / 23°C (ultra-low signal loss, critical for high-frequency systems up to 77 GHz)

Decomposition Temperature (Td): >500°C (resistant to high temperatures, suitable for harsh operating environments)

Thermal Conductivity: 0.5 W/mK (efficient heat dissipation to protect sensitive components)

Moisture Absorption: 0.04% (minimal water uptake, preventing performance degradation in humid conditions)

Coefficient of Thermal Expansion (CTE): X-axis 17 ppm/°C, Y-axis 16 ppm/°C, Z-axis 25 ppm/°C (measured from -55°C to 288°C; low in-plane expansion matches copper, reducing thermal stress)

4.3 Core Benefits of Rogers RO3003

These features translate to tangible advantages for design and end-use:

Low Dielectric Loss for High Frequencies: Enables reliable operation in applications up to 77 GHz (e.g., automotive radar, 5G mmWave)

Excellent Mechanical Properties vs. Temperature: Maintains structural integrity across wide temperature ranges, supporting reliable stripline and multi-layer board constructions (even in harsh environments like automotive underhood systems)

Uniform Mechanical Properties: Works with a range of dielectric constants, making it ideal for multi-layer designs and hybrid assemblies with epoxy glass boards

Stable Dk vs. Temperature & Frequency: Ensures consistent performance for band pass filters, microstrip patch antennas, and voltage-controlled oscillators (VCOs)—critical for precision RF systems

Low In-Plane Expansion (Copper-Matched): Reduces stress on surface-mounted assemblies (SMAs), improving reliability in temperature-sensitive applications and ensuring excellent dimensional stability

Volume Manufacturing Compatibility: Economical pricing and scalable production processes, making it suitable for high-volume commercial projects

5. Some Typical Applications

- Automotive radar applications

- Global positioning satellite antennas

- Cellular telecommunications systems - power amplifiers and antennas

- Patch antenna for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners