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RO3006 PCB 5mil Double-Sided with Pure gold 30u"

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-052.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Rogers RO3006
Layer count: 2-layer
PCB thickness: 0.2mm
PCB size: 20mm × 25mm
Copper weight: 1oz (equivalent to 1.4 mils or 35μm)
Surface finish: Pure gold 30u"
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RO3006 PCB 5mil Double-Sided with Pure gold 30u"

RO3006 PCB 5mil Double-Sided with Pure gold 30u"

This 2-layer rigid PCB is tailored for high-performance commercial microwave and RF applications, utilizing the superior electrical and mechanical stability of Rogers RO3006 ceramic-filled PTFE composite laminates. Thanks to its ultra-compact size, precise manufacturing specifications, and consistent performance across temperature changes, it's an optimal choice for space-limited and temperature-sensitive high-frequency electronic systems.


1. PCB Specifications

The PCB’s construction is optimized for precision, miniaturization, and compatibility with high-frequency operational demands, with key parameters outlined as follows:

ParameterSpecification
Base MaterialRogers RO3006 (ceramic-filled PTFE composite laminate)
Layer Count2 layers (top and bottom outer copper layers)
Board Dimensions20mm × 25mm per unit (1PCS)
Minimum Trace/Space5 mils (trace width) / 9 mils (trace spacing)
Minimum Hole Size0.2mm; no blind vias supported
Finished Board Thickness0.2mm
Finished Copper Weight (Outer Layers)1oz (equivalent to 1.4 mils or 35μm)
Via Plating Thickness20μm
Surface FinishPure gold 30u" (specifically designed for wire bonding applications, ensuring excellent conductivity and bonding reliability)
SilkscreenNo
Solder MaskNo
Quality Assurance100% electrical testing conducted prior to shipment (effectively eliminating open/short circuit issues and ensuring operational reliability)

2. PCB Stack-up Configuration

LayerThicknessFunction
Top Copper Layer (Copper_layer_1)35μmServes as the primary layer for high-frequency signal traces and top-side SMT pads, ensuring efficient signal transmission
Rogers RO3006 Substrate5 mils (0.127mm)Acts as the dielectric core, providing exceptional electrical stability across temperature ranges to support reliable microwave and RF performance
Bottom Copper Layer (Copper_layer_2)35μmFacilitates ground plane setup, additional signal routing, or thru-hole component connections, enhancing overall circuit functionality

3. Quality Standards & Global Availability


Artwork Format: Gerber RS-274-X (the universal industry standard for PCB manufacturing)


Accepted Quality Standard: IPC-Class-2 (meets strict requirements for performance, durability, and consistency)


Availability: Globally accessible (support projects across different countries and regions)



4. Rogers RO3006 Substrate: Introduction, Features & Benefits


4.1 Introduction to Rogers RO3006

Rogers RO3006 laminates are high-performance ceramic-filled PTFE composites developed to deliver outstanding electrical and mechanical stability. A key advantage is their stable dielectric constant (Dk) across a wide temperature range, which eliminates the typical step change in Dk that affects standard PTFE glass materials near room temperature. This characteristic ensures consistent performance, making it a preferred choice for demanding microwave and RF systems.


4.2 Key Features of Rogers RO3006

PropertyValueSignificance
Material CompositionCeramic-filled PTFE compositeBalances low signal loss with excellent mechanical strength
Dielectric Constant (Dk)6.15 ± 0.15 at 10 GHz / 23°CTight tolerance ensures predictable signal propagation and consistent performance
Dissipation Factor0.002 at 10 GHz / 23°CUltra-low signal loss critical for maintaining signal integrity in high-frequency applications
Decomposition Temperature (Td)>500°CHigh thermal resistance suitable for harsh high-temperature environments
Thermal Conductivity0.79 W/mKEfficient heat dissipation protects sensitive components and prevents overheating
Moisture Absorption0.02%Minimal water uptake ensures stable performance in humid conditions
Coefficient of Thermal Expansion (CTE)X-axis 17 ppm/°C, Y-axis 17 ppm/°C, Z-axis 24 ppm/°C (measured from -55°C to 288°C)Low in-plane expansion matches copper, reducing thermal stress on PCB and components

4.3 Core Benefits of Rogers RO3006

These features translate to tangible advantages for both circuit design and end-use performance:


Uniform Mechanical Properties Across Dielectric Constants: Compatible with a range of dielectric constants, making it ideal for multi-layer board designs and hybrid assemblies with epoxy glass multi-layer boards, enhancing design flexibility


Low In-Plane Expansion Coefficient (Copper-Matched): Matches the expansion coefficient of copper, enabling more reliable surface-mounted assemblies, suitable for temperature-sensitive applications, and ensuring excellent dimensional stability over temperature variations


Volume Manufacturing Compatibility: Supports high-volume production processes with economical laminate pricing, reducing overall production costs while maintaining high quality


5. Some Typical Applications

- Automotive radar applications

- Global positioning satellite antennas

- Cellular telecommunications systems - power amplifiers and antennas

- Patch antenna for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes


In short, this 2-layer Rogers RO3006 PCB features precise manufacturing, compliant quality, and a high-performance substrate, offering a cost-efficient and reliable solution for commercial microwave and RF applications. With its compact design, low signal loss, and temperature stability, it's ideal for next-gen high-frequency electronics development.


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