Custom Geometry High Precision Waffle Pack Chip Trays For Non
Standard Component Protection
The Custom Geometry Waffle Pack Chip Tray series is specifically
developed for microelectronic components that do not conform to
standard rectangular dimensions. While traditional "off-the-shelf"
trays often fail to provide adequate support for complex 2.5D
devices, these high-precision 2-inch and 4-inch waffle packs are
engineered from the ground up to match your specific device
footprint.
Each tray features a thin, waffle-like profile with a regular
pattern of separator ribs that create protective pockets. What sets
this series apart is the integration of Moldflow analysis during
the initial product mold design phase. This advanced simulation
allows our engineering team to accurately predict material
behavior, ensuring that the final injection-molded product achieves
superior size precision and planar degree. By controlling material
characteristics and mold structures with such granularity, we meet
the most stringent quality requirements of the semiconductor and
photonics industries.
These trays are not just carriers; they are mechanically optimized
environments that safeguard, automate, and store a wide variety of
products, ranging from bare die to delicate medical sensors.
Key Features/ Benefits
Specifications
| Brand | Hiner-pack |
| Model | HN24082 |
| Material | PC |
| Tray Type | 2-inch Waffle Pack |
| Color | Black |
| Resistance | 1.0×10⁴ - 1.0×10¹¹ Ω |
| Outline Line Size | 50.8x50.8x4mm |
| Cavity Size | 1.55x0.80x0.45mm |
| Matrix QTY | 10x10=100PCS |
| Warpage | MAX 0.2mm |
| Service | Accept OEM, ODM |
| Certifications | RoHS, ISO |
Applications
These custom-engineered waffle packs are the ideal solution for
non-standard microelectronic assembly and specialized component
handling. Their primary applications include: Prototype Assembly of
New Sensors, where the pocket must match a unique physical profile;
Handling of Fragile Medical Micro-Parts, such as surgical implants
or diagnostic sensors; and Secure Transport of Specialized Gems or
Watch Components, where high-value items require individual,
anti-crush compartments. They are also widely utilized in
Engineering Lines transitioning to Automation, providing a
consistent interface for custom tools. Because they adhere to the
unofficial industry-standard 2-inch or 4-inch footprint, they
remain compatible with existing waffle pack accessories like covers
and clips while offering a completely bespoke internal environment.
Customization
We provide a comprehensive "design-from-scratch" service to meet
your most challenging packaging needs. Customization options extend
to Component Support Features, such as pedestals that lift the part
to protect bottom-side features, or Reference Marks and Fiducials
molded directly into the tray to aid machine vision systems. You
can specify the Material Type (Conductive ABS, PC, or high-temp
resins), Color-Coding for lot identification, and even Engraving
for part numbers. Whether your part requires terminal isolation or
specialized pad protection, our team can optimize the pocket
geometry to ensure 100% alignment. For low-volume needs, we also
offer CNC machining or 3D printing options, though molded trays
remain the gold standard for high-precision, ESD-safe mass
production.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that
integrates Design, R&D, Manufacturing, Sales of IC packaging
and testing, as well as semiconductive wafer fabrication process in
automated handling, carrying, and transportation to provide
customers with turnkey services.
Why Choose Us:
- Factory-direct manufacturer of JEDEC & IC trays
- JEDEC compliant, automation-compatible designs
- OEM & ODM customization supported
- Consistent quality and stable supply
- Trusted by global semiconductor customers
Customized 2”VCM IC Chip Tray die pack For Small Particle Chips
