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Aluminum Folded Fin Heatsink High-Performance Thermal Management Component

Aluminum Folded Fin Heatsink

Material: copperSize:22.5*11.4*0.8CMWeight: 0.08kgTechnology: StampingFeature: Flexible and adjustableSurface treatment: Oil-cleaningHeat cooling power: 30WYou can rest assured to buy Aluminum Folded Fin Heatsink from our factory and we will offer you the best after-sale service and timely delivery.

Product parameters of Aluminum Folded Fin Heatsink

Material: copper

Size:22.5*11.4*0.8CM

Weight: 0.08kg

Technology: Stamping

Feature: Flexible and adjustable

Surface treatment: Oil-cleaning

Heat cooling power: 30W

Product advantage of Aluminum Folded Fin Heatsink

Every electrical and electronic component in a circuit generates some amount of heat while the circuit is executed by providing power supply. Typically high-power semiconducting devices like power transistors and the opto electronics such as light emitting diodes,lasers generate heat in considerable amounts and these components are inadequate to dissipate heat, as their dissipation capability is significantly low.

Due to this, heating up of the components leads to premature failure and may cause failure of the entire circuit or system’s performance. So, to conquer these negative aspects, heat sinks must be provided for cooling purpose.

What is a Heat Sink?

Heat sink is an electronic component or a device of an electronic circuit which disperses heat from other components (mainly from the power transistors) of a circuit into the surrounding medium and cools them for improving their performance, reliability and also avoids the premature failure of the components. For the cooling purpose,it incorporates a fan or cooling device.

An Aluminum Folded Fin Heatsink is a high-performance thermal management component, designed to efficiently dissipate heat from electronic and industrial devices via a dense, folded-fin structure made of aluminum foil/ sheet.

Manufacturing & Materials

Process: Thin aluminum sheets (0.1–0.5 mm typical, 0.2–1.2 mm common range) are precision-folded into a corrugated/zig-zag array, then bonded to an aluminum base plate via soldering, brazing, or high-performance thermal epoxy. This allows independent optimization of fin density and base thickness, and even mixed-material combinations (e.g., copper base+aluminum fins).
Common Alloys: 1050/1100 (high purity, excellent thermal conductivity), 6061/6063 (good strength+thermal performance, cost-effective).
Key Parameters: Fin pitch down to 0.5 mm, fin height up to 100 mm, fin width up to 500 mm.

Core Advantages

High Surface Area-to-Volume Ratio: Far denser than extruded fins, ideal for space-constrained, high-heat applications, with reduced thermal resistance (up to 60% vs. some traditional designs).
Lightweight & Material-Efficient: Uses minimal aluminum while maximizing cooling surface.
Flexible Design: Easy customization of fin height, pitch, and shape for forced/natural convection.
Compatible with Heat Pipes/Vapor Chambers: Often integrated for enhanced thermal spreading in high-power systems.

Applications

Widely used in servers, telecom equipment, power inverters, LED lighting, automotive electronics, and industrial power supplies—especially where forced air cooling (fans) is available and space is limited.

Type	Pros	Cons	Best For
Folded Fin (Aluminum)	Ultra-high surface area, lightweight, customizable	Higher cost than extrusion, requires bonding	High-power, compact, forced-air systems
Extruded Aluminum	Low cost, simple manufacturing, rigid	Limited fin density/aspect ratio	Low-to-mid power, cost-sensitive applications
Skived Fin	Excellent thermal contact, high density	Limited fin height, higher tooling cost	Heat pipes, high-performance CPUs

Selection & Optimization Tips

Thermal Load & Airflow: Calculate required thermal resistance (Rθ) and match to airflow (LFM/CFM); forced air works far better with dense folded fins.
Fin Pitch & Height: Tighter pitch=more surface area, but may restrict airflow; taller fins boost convection but increase weight/backpressure.
Bonding Quality: Poor soldering/brazing creates contact resistance—verify bond integrity via thermal imaging or resistance testing.
Surface Treatment: Anodizing improves corrosion resistance and can slightly enhance radiation; black anodize helps in radiative cooling scenarios.

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Categories	Liquid Cooling Plate
Brand Name:	Uchi
Model Number:	Heat Sink
Certification:	SMC
Place of Origin:	Dongguan，Guangdong,China
MOQ:	100pcs
Price:	1300-1500 dollars
Payment Terms:	T/T，paypal， Western Union,MoneyGram
Supply Ability:	50000000pcs per Month
Delivery Time:	not limited
Material:	copper
size:	22.511.40.8CM
Weight::	0.08kg
Technology:	Stamping
Feature:	Flexible and adjustable
Surface treatment:	Oil-cleaning
Heat cooling power:	30W