CLTE-XT double sided Copper Clad Laminate 0.508 mm 0.763mm thick material Optimized for Advanced RF Performance

CLTE-XT™ High-Frequency Copper Clad Laminate: Optimized for Advanced RF Performance

CLTE-XT™ represents an evolution in high-frequency circuit materials, engineered to deliver enhanced electrical performance while maintaining robust mechanical and thermal reliability. As an advanced variant within the proven CLTE series, this PTFE-based laminate is specifically designed for demanding RF and microwave applications that require ultra-low signal loss, improved thermal stability of electrical properties, and consistent performance across frequency ranges. CLTE-XT is particularly well-suited for next-generation aerospace, defense, and telecommunications systems where signal integrity and power efficiency are paramount.

A defining characteristic of CLTE-XT is its significantly reduced Dissipation Factor (0.0010 @ 10 GHz), which represents less than half the signal loss of standard CLTE material. This makes it ideal for high-frequency, high-power applications where minimizing insertion loss is critical. Furthermore, CLTE-XT exhibits a negative Thermal Coefficient of Dielectric Constant (-8 ppm/°C), providing exceptional stability of electrical performance over temperature variations—a crucial advantage in environments with wide operational temperature ranges.

While offering superior electrical properties, CLTE-XT maintains excellent reliability with a UL 94 V-0 flammability rating, very low moisture absorption (0.02%), and outstanding thermal resistance, including a Time to Delamination exceeding 60 minutes at 288°C. Its balanced thermal expansion characteristics and strong copper adhesion ensure dimensional stability and reliable performance in multilayer constructions and challenging thermal environments.

Standard Properties Table

Standard Specifications of CLTE-XT Laminate:

Electrical Properties (@ 10 GHz, 23°C):

• Design Dielectric Constant (Dk): 2.93
• Process Dk by Thickness (see table below): 2.79-2.94
• Dissipation Factor (Df): 0.0010
• Thermal Coefficient of Dk: -8 ppm/°C
• Volume Resistivity: 4.25 × 10⁸ MΩ·cm
• Surface Resistivity: 2.49 × 10⁸ MΩ
• Dielectric Strength: 1000 V/mil

Thermal Properties:

Coefficient of Thermal Expansion (CTE):

• X-axis: 12.7 ppm/°C
• Y-axis: 13.7 ppm/°C
• Z-axis: 40.8 ppm/°C
• Decomposition Temperature (Td): 539°C
• Thermal Conductivity: 0.56 W/(m·K) (improved over CLTE)
• Time to Delamination (@ 288°C): >60 minutes

Mechanical & Physical Properties:

• Copper Peel Strength (after 10s @ 288°C): 1.7 N/mm (9 lbs/in)
• Dimensional Stability: -0.37 mm/m (MD), -0.67 mm/m (CMD)
• Moisture Absorption: 0.02%
• Flammability Rating: UL 94 V-0
• Density: 2.17 g/cm³

Dielectric Constant by Thickness:

• 0.0051" (0.130 mm): Dk = 2.79 ±0.03
• 0.0094" (0.239 mm): Dk = 2.89 ±0.03
• 0.020" (0.508 mm): Dk = 2.92 ±0.03
• 0.030" (0.762 mm): Dk = 2.94 ±0.03

Standard Product Offerings:

Available Thicknesses & Tolerances:

• 0.0051" (0.130 mm) ±0.0005"
• 0.0094" (0.239 mm) ±0.0007"
• 0.020" (0.508 mm) ±0.0010"
• 0.030" (0.762 mm) ±0.0010"

Standard Panel Sizes: 18" × 12" (457 × 305 mm) and 18" × 24" (457 × 610 mm)

Standard Copper Claddings: Same as CLTE, including Electrodeposited and Reverse Treated Copper Foils in ½ oz (18 µm) and 1 oz (35 µm) weights

CLTE-XT laminate delivers an optimal balance of ultra-low loss, temperature-stable electrical properties, and proven reliability. Its thickness-tuned dielectric constant and enhanced thermal characteristics make it an intelligent choice for designers seeking to maximize performance in advanced RF circuits, antenna systems, and high-frequency communications infrastructure where every decibel of loss matters.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. The circuit board ranges from conventional FR-4 to PTFE, metal core to flexible circuits which are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

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