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DDR5 DDR4 Memory Heat Sink Series H50 H40

Categories DDR Memory
Brand Name: KingDian
Certification: RoHS,CE,FCC,ISO
Place of Origin: China
Model Number: H50 H40
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DDR5 DDR4 Memory Heat Sink Series H50 H40

Key Parameters

KingDian Desktop Memory Heatsink Series

Interface: DDR5/DDR4

DIMM Type: UDIMM

Heat Dissipation Function: Yes

DDR5 Frequency: 4800/5600/6000/6400/6800/7200MHz

DDR4 Frequency: 2400/2666/3200MHz

Capacities Available: 4GB/8GB/16GB/32GB

Voltage: 1.1/1.2/1.35/1.4V

Storage Temperature: -40-75℃

Operating Temperature: 0-75℃

Key Features
  • Next-Generation Performance - DDR4 memory gained widespread recognition primarily due to the higher operating frequencies and larger-capacity memory modules it offered. The new generation of DDR5 memory, meanwhile, has further raised the performance benchmark, featuring operating frequencies that far exceed those of DDR4.
  • Optimal Cooling - Memory modules equipped with heat sinks can dissipate heat away from critical areas and provide a larger surface area for heat dissipation, thereby accelerating the memory cooling process.
  • Enhanced Power Efficiency - DDR5 memory modules incorporate advancements in power management, operating at lower voltages while maintaining high performance.
  • Optimized for Gaming and Content Creation - It offers substantially faster speeds, enhancing overall system performance, responsiveness, and multitasking capabilities. This is particularly beneficial for gamers, content creators, and professionals handling resource-intensive tasks.
  • Desktop Memory Dealer - KingDian uses strict incoming inspection standards, professional production processes and strict quality management methods to provide a series of DDR Memory products for long-term use with wide compatibility, high stability, high read-write performance, and excellent compatibility with mainstream computing platform solutions.
Product Specifications
SeriesDDR5 With Heatsink UDIMM Series(H50 Series)
BrandKingDian
Model NumberH50-DDR5-PC-8GBH50-DDR5-PC-16GBH50-DDR5-PC-32GB
Capacity8GB16GB32GB
EAN6935515104902693551510489669355151395466935515139539693551510488969355151048726935515104865693551510485869355151395226935515139515693551510484169355151048346935515104827693551510493369355151395086935515139492
Memory Speed / Frequency4800MHz5600MHz6000MHZ6400MHZ4800MHz5600MHz6000MHZ6400MHZ6800MHZ7200MHZ4800MHz5600MHz6000MHZ6400MHZ6800MHZ7200MHZ
Rank (1Rx8/2Rx8/8Rx4)1Rx81Rx82Rx82Rx81Rx81Rx82Rx82Rx82Rx82Rx82Rx82Rx82Rx82Rx82Rx82Rx8
CAS LatencyCL40-40-40-77CL46-45-45-90CL46-48-48-96CL32-39-39-80CL40-40-40-77CL46-45-45-90CL46-48-48-96CL32-39-39-80CL34-45-45-108CL34-45-45-115CL40-40-40-77CL46-45-45-90CL46-48-48-96CL32-39-39-80CL34-45-45-108CL36-46-46-116
Operating Voltage1.1v1.1v1.351.4v1.1v1.1v1.351.4v1.4v1.4v1.1v1.1v1.351.4v1.4v1.4v
No. of Memory IC8/16
Power Consumption3W
Controller ICNO
Overclock Support (YES / NO)NO
ECC (Error Correction Code) (YES/NO)NO
Net Weight (g)40g
Gross Weight (g)75g
Pin Count288
OEM/ODM SupportYES
Heat Sink / Heat SpreaderYES
Form FactorUDIMM
Computer Memory Type (DRAM/SDRAM)DRAM
Operating Temperature0-70℃
Storage Temperature-40~85℃
Warranty3 Years
No. of Memory Channels (Single/Dual)(Single/Dual)
Product Dimension (W x D x H) in mm145x43x5mm
Buffered / Un-buffered MemoryUn-buffered Memory
Memory IC BrandMicron/Samsung/Sk Hynix
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