Product Description

Silver-Plated Copper Wire (0.05mm Solid)

Product Overview

Standard Designations & Core Material Foundation

• Base Material: High-purity oxygen-free copper (OFC, ≥99.99%)
• Plating Material: 99.9% pure silver
• Key Specification: 0.05mm single strand (diameter tolerance ±0.002mm)
• Plating Thickness: 0.5–2.0μm (customizable)
• Compliant Standards: ASTM B500, GB/T 4910, IEC 60884
• Manufacturer: Huona New Material, certified to ISO 9001 and IATF 16949, with advanced ultra-fine wire drawing and plating lines

Key Core Advantages (Centered on 0.05mm & Silver Plating)

1. Ultra-High Conductivity & Signal Transmission

• Enhanced Conductivity: Silver (σ=63×10⁶ S/m) has higher conductivity than copper, reducing signal loss in high-frequency applications. The 0.05mm diameter ensures minimal skin effect impact, making it ideal for high-speed data transmission in miniaturized devices.
• Low Contact Resistance: The silver plating provides a low-resistance surface, ensuring reliable electrical connections in connectors and switches, even after repeated mating cycles.

2. Excellent Oxidation & Corrosion Resistance

• Silver Protective Layer: The dense silver plating prevents copper oxidation at high temperatures or in humid environments, maintaining stable conductivity over time.
• Corrosion Resistance: Resists sulfurization and most chemical corrosion, suitable for harsh environments such as aerospace and industrial control systems.

3. Superior Mechanical Properties & Processability

• High Ductility: Despite its ultra-fine 0.05mm diameter, the wire maintains good ductility (elongation ≥15%), enabling bending and winding on extremely small mandrels (≥0.1mm) without breaking.
• Uniform Plating: Advanced electroplating technology ensures a uniform silver layer with no peeling or blistering, even after severe drawing and annealing processes.

Technical Specifications

Product Specifications

Typical Application Scenarios

• Miniaturized Electronics: Used in fine-pitch connectors, bonding wires, and flexible circuits for smartphones, wearables, and medical devices.
• Aerospace & Defense: High-frequency signal wires, sensor leads, and lightweight wiring harnesses in aircraft and satellite systems.
• High-Frequency Communication: RF cables, antenna elements, and microwave components requiring low loss and high conductivity.
• Automotive Electronics: Sensor wires and high-speed data lines in advanced driver-assistance systems (ADAS).

Huona (Shanghai) New Material Co., Ltd. Was established in 2008, currently have three divisions: Magnesium Division, Thermal Spray Division and Functional Material Division.

Magnesium Division produces magnesium metal products. Various models of high-quality magnesium alloy plate, magnesium rods, high-purity magnesium, magnesium plate, magnesium die casting, magnesium extrusion profiles and other metal magnesium and deep processing products.

Thermal spray wire Division offers a wide variety of pure metal and metal alloy wires, including nickel-, iron-, aluminum-, and zinc-based wires for thermal spray projects.

Fuctional Material Division supply electronic packaging COMPONENTS(GTMS, CTMS), soft magnetic alloys and bimetal strip.

Our company is certified by ISO9001 quality system and ISO14001 environmental protection system.

Mission Statement

We try our best to understand and utilize information within the environment. With this competency, we assist customers to create added value and contribute to the development of industry and healthy living.

We strive for "Best, " welcome challenges, and are relentless till we deliver products and solutions.