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Safe HighPrecision Microfocus X-Ray Inspection System X6800

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Company Info.

SHENZHEN WEIMING PHOTOELECTRIC CO.,LTD.

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Key Advantages

Hardware Specifications

X-ray Source
Type	Closed, microfocus
Max tube voltage	90kV(110kv,130kv optional)
Max tube current	200μA
Focal spot size	5μm
Function	Auto preheat
Flat Panel Detector
Effective area	130mm×130mm
Pixel size	85μm
Resolution	1536×1536
Frame rate	20fps
Tiltable angle	60°
Table Specifications
Size	530mm×530mm
Detectable area	500mm×500mm
Max load	10kg
Equipment Specifications
Magnification	Geometry 200X	System 1500X
Inspection speed	Max 3.0s/point
Dimensions	1360mm (L) × 1365mm (W) × 1730mm (H)
Weight	1200kg
Power supply	AC110-220V 50/60HZ
Max power	1500W
Industrial PC	I5 CPU, 8G RAM, 500GB SSD
Displayer	24" HDMI LCD
Safety Features
Radiation leakage: No leakage, meeting international standard (≤1μSv/h)
Transparent lead glass observation window for safe internal viewing
Window and back door safety interlock system
Electromagnetic safety switch locks when X-ray is active
Emergency stop button located near operation position
Automatic tube protection when leaving software interface

Working Principle

Software Capabilities

Function Module	Operation
X-ray tube control	Mouse-click operation with real-time voltage/current display and adjustment
Status bar	Visual indication of interlock, pre-heat and X-ray status
Image effect adjustment	Customizable brightness, contrast and gain settings
Product list	Save and recall inspection parameters for efficiency
Navigation window	Click-to-move functionality for precise positioning
Motion axis status	Real-time coordinate display
Inspection result	Organized display of measurement results with pass/fail indicators
Speed control	Adjustable movement speed for each axis

Measurement Functions

Voids rate measurement: Automatic calculation supported by adjustable parameters
Distance measurement: Vertical distance calculation based on preset baseline
Distance rate: Through-hole soldering rate measured via percentage ratio calculation
Angle measurement: Precise calculation of angles between designated points
Radius measurement: Radius measurement tailored for round components (e.g., solder balls)
Perimeter measurement: Perimeter measurement for square components, with length, width and area data provided

Automated Inspection Modes

Manual setting: Customizable inspection point placement for automatic inspection and image saving
Array: Automated inspection of regular points via two reference points + row/column configuration
Automatic identification: Feature-driven position recognition with automated measurement and image storage

Application Examples

BGA Solder Bridge

BGA Solder Voids

PCB Through-Hole

IC Voids & Gold Wire

LED Solder Voids

LED Gold Wire Crack

Capacitor

Inductor

Sensor

Product Tags:

high precision microfocus X-ray system

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