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| Categories | Liquid Cooling Data Center |
|---|---|
| Brand Name: | Soeteck, AICoolit |
| Certification: | CE, ISO, UL |
| Place of Origin: | China |
| MOQ: | 1 |
| Model Number: | AICoolit-HDC |
| Price: | To Be Negotiated |
| Delivery Time: | 5-10 |
| Payment Terms: | L/C,D/A,D/P,T/T |
| Packaging Details: | 40 Feet Standard Container |
| Liquid Cooling Technology: | Cold Plate Liquid Cooling |
| Dimensions (W×D×H): | 3200 × 12800 × 3800 mm |
| Power Density per Cabinet: | 100 KW |
| Cooling Configuration: | 8×80 KW Rack-Mounted CDU + 5×50.5 KW In-Row AC |
| Heat Dissipation Method: | Dry Cooler / Closed-Circuit Cooling Tower |
| Air-to-Liquid Ratio: | 2:8 |
| UPS Capacity: | ≥1000 KVA Modular UPS |
| Battery Configuration: | External Battery Pack (Customizable Capacity) |
| Safety Features: | N+1 Redundancy for Core Components; Non-Conductive Coolant; Multi-Layer Leak Monitoring |
| Communication Protocols: | Modbus / SNMP |
| Applicable Scenarios: | Large-Scale AI Training Clusters, Supercomputing Centers, Core Financial Data Centers |
| Company Info. |
| HEFEI SHUYI DIGITAL POWER CO.,LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
The AICoolit™ High-Density Cluster Module integrates cold plate liquid cooling technology with 8 rack-mounted CDUs (80KW each) to deliver industry-leading thermal management for ultra-high-power computing scenarios. As a 40-foot prefabricated container solution (12800×3200×3800 mm), it achieves a 100KW per cabinet power density and an optimized 2:8 air-to-liquid ratio, ensuring direct and efficient heat transfer from high-density GPU/CPU clusters.
Designed for large-scale AI training, supercomputing centers, and core financial data centers, it features N+1 redundant core components, non-conductive coolants, and multi-layer leak-proof monitoring. The factory-prefabricated integration of power distribution (≥1000KVA UPS), cooling, and intelligent control systems enables rapid on-site deployment with minimal configuration.
| Model | Cooling Capacity | Rated Power (Per Cabinet) | Air-Liquid Ratio | Cooling Technology | Dimensions (WxDxH, mm) |
|---|---|---|---|---|---|
| AICoolit-HDC › | 8×80 KW CDU + 5×50.5 KW AC | 100 KW | 2:8 | Cold Plate Liquid Cooling | 3200 x 12800 x 3800 |
| AICoolit-ISM › | 350 KW CDU + 4×31.5 KW AC | 50 KW | 2:8 | Cold Plate Liquid Cooling | 3200 x 12192 x 3800 |
| AICoolit-ECM › | 4×50 KW CDU + 2×30 KW AC | 50 KW | 1:9 | Cold Plate Liquid Cooling | 3200 x 6500 x 3500 |
| AICoolit-ICM › | 4×400 KW CDU | 55 KW | 0:10 | Immersion Liquid Cooling | 3200 x 12192 x 3800 |
Delivers 100KW per cabinet power density with an optimized 2:8 air-to-liquid ratio, leveraging cold plate liquid cooling for direct heat transfer from high-density GPU/CPU clusters. N+1 redundant core components (CDUs, pumps, power modules) ensure 99.999% uptime, while non-conductive coolants and multi-layer leak-proof monitoring eliminate safety risks.
40-foot prefabricated container integrates ≥1000KVA modular UPS, external battery packs, and intelligent control systems. Factory-tested and pre-configured, it supports rapid on-site deployment (≤72 hours) for large AI training clusters and supercomputing centers, eliminating complex on-site assembly.
Focus on the core cooling demands of high-density data center deployments, where our full range of liquid cooling products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation.
In-Rack / In-Row / In-Room
The heart of liquid cooling. Available in Rack-mounted (50-80kW), In-Row (350-900kW), and large-scale In-Room (up to 2MW) configurations. Features N+1 redundancy and smart control.
PUE < 1.2
Single-phase immersion technology for ultimate heat dissipation. Integrated plug-and-play design suitable for edge nodes and high-density clusters. Silent operation with PUE < 1.2.
Prefab & Modular
Rapid-deployment modular data center. A turnkey solution integrating power, liquid cooling (Cold Plate or Immersion), and monitoring. Ideal for AI training and crypto mining.
High-Quality
Essential components for safety and efficiency. Includes high-precision Manifolds, flexible Secondary Loops, and Quick Disconnects (QD) with leak-prevention design.
Empowering next-generation infrastructure with superior thermal management for high-wattage computing demands.
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