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| Categories | AI Ready Data Center |
|---|---|
| Brand Name: | Soeteck |
| Model Number: | SYICDC40 |
| Certification: | CE, ISO, UL |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | To Be Negotiated |
| Payment Terms: | D/A |
| Supply Ability: | 10000/Month |
| Delivery Time: | 5-10 Weeks |
| Packaging Details: | 20/40ft High Cube Container |
| Deployment Time: | 5-10 Weeks |
| Rack Quantity: | 4/9/12 pcs |
| Single Rack Capacity: | 42U |
| Single Rack Max. Capacity: | 50/60/100kW |
| Power Sypply: | On Demand |
| Cooling Type: | Liquid Cooling/Air Cooling/Water Cooling/Chilled Water |
| Rack Dimensions (W*D*H): | 600*1100*2000mm |
| Applications: | AI Training, Edge Computing, Remote Sites, Disaster Recovery |
| Monitoring System: | Yes |
| Door Security System: | Yes |
| EPO: | Yes |
| Video Monitoring System: | Yes |
| Company Info. |
| HEFEI SHUYI DIGITAL POWER CO.,LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
Deploying large-scale, homogeneous AI clusters (such as NVIDIA HGX/DGX pods) requires a cooling architecture that is both highly efficient and streamlined. Managing hundreds of individual cooling loops in a dense AI-ready data center environment can become an operational headache if not centralized—especially for the demanding thermal needs of AI training and inference workloads.
Optimized for these uniform high-performance AI-ready environments, the 40ft ODM Cold Plate Liquid Cooling Data Center Container for AI-Ready Data Centers offers a centralized "Hybrid Cooling" architecture. It simplifies facility management while delivering precise thermal control to high-density AI racks without the complexity of distributed components, embodying the customizable ODM advantage for tailored AI data center deployments.
By employing powerful Cold Plate Liquid Cooling technology (the core of this 40ft ODM AI-ready data center container), it creates an efficient secondary loop managing heat from 12 racks simultaneously. It directs liquid coolant to AI processors via cold plates (Direct-to-Chip) while integrated air handlers manage residual heat, creating an ideal turnkey ODM solution for standardized, high-density AI training and workload deployment.
| Model | Cooling Architecture | Rack / Tank Count | Max Power Density | Total Capacity | Container Type | Dimensions (L*W*H) |
|---|---|---|---|---|---|---|
| 20ft Immersion › | Single-Phase Immersion (Integrated FDU) | 4 Tanks | 100 kW / Tank | 400 kW | 20ft High Cube | 6058 x 2438 x 2896 mm |
| 40ft Immersion › | Single-Phase Immersion (Integrated FDU) | 12 Tanks | 100 kW / Tank | 1.2 MW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 40ft Cold Plate (In-Row) › | In-Row CDU (Liquid-to-Liquid / Air Assist) | 12 Racks (Space for CDUs) | 60 kW / Rack | 720 kW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 40ft Cold Plate (Rack) › | Rack-Mounted CDU (Distributed Manifold) | 14 Racks (Maximized Space) | 50 kW / Rack | 700 kW | 40ft High Cube | 12192 x 2438 x 2896 mm |
| 20ft Cold Plate (Rack) › | Rack-Mounted CDU (Distributed Manifold) | 5 Racks | 50 kW / Rack | 250 kW | 20ft High Cube | 6058 x 2438 x 2896 mm |
Large-capacity In-Row CDUs operate in redundancy, ensuring continuous coolant flow to all racks even during pump maintenance. This centralized approach simplifies the piping network and reduces overall maintenance points.
The system utilizes a negative pressure or leak-safe design in the secondary loop, combined with distributed leak sensing tape along the manifolds to ensure instant detection and isolation, protecting your critical assets.
Focus on the core cooling demands of high-density data center deployments, where our full range of premium products leverages advanced technological advantages to reliably safeguard continuous, efficient, and stable operation.
5-30 kW per Cabinet
Airtight cold aisle enclosure, 90%+ cold air utilization rate, PUE ≤ 1.2, fast deployment and flexible expansion for medium-density IT loads.
10-80 kW Total Power
Prefabricated all-in-one design, anti-vibration & dust-proof, plug-and-play, ideal for edge computing and temporary computing demand scenarios.
30-100 kW per Cabinet
Hybrid air-liquid cooling, direct heat dissipation from GPU/CPU, AI-ready design, high power density with low energy consumption.
50-200 kW per Cabinet
Immersion cooling with dielectric fluid, 100x higher heat dissipation efficiency than air cooling, PUE ≤ 1.1, perfect for ultra-high density AI clusters.
Empowering next-generation infrastructure with superior thermal management for high-wattage computing demands.
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