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Beryllium Oxide (BeO) parts

Categories Technical Ceramic Parts
Brand Name: ZG
Model Number: MS
Certification: CE
Place of Origin: China
MOQ: 1 PC
Price: 10USD/PC
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 1000 PCS
Delivery Time: 5-8 work days
Packaging Details: Strong wooden box for Global shipping
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Beryllium Oxide (BeO) parts

Beryllium Oxide (BeO) parts


Beryllium oxide [BeO] has a unique combination of thermal, electrical, optical and mechanical properties that are used for a wide range of applications: from thermal control systems and integrated electronics to high-temperature refractory components and nuclear reactors. Beryllium oxide has no analogues among oxide-ceramic materials in terms of thermal conductivity.


BeO-based ceramics have a thermal conductivity exceeding that of many metals, second only to copper and silver. At the same time, the thermal conductivity of BeO is 10 times higher than that of Al2O3, and 1.5 times higher than that of AlN.


The dielectric constant is lower than that of aluminum oxide and nitride. In this connection, BeO is an excellent insulator with a volumetric resistance of the order of 1014 ... 1018 ohms * cm, which depends on the purity of the material.


In addition to high heat resistance, BeO has excellent strength with high values of specific stiffness.


Ceramics based on beryllium oxide BeO are produced according to TU23.43.10-008-34576770-2017 under the trademarks OBK-97 and OBK-100.


Specifications

Properties

Conditions

Units of measurement

Material

BeO 99,5%

Colour



brown

Bulk density


г/см3

≥2,85

Water absorption

%

0





Flexural strength


МПа

≥180





Coefficient of thermal expansion

25-1000 °C

10-6 /°C

40-400 °C

10-6 /°C

7,0 ~ 8,5

Thermal conductivity

25 °C

Вт/м∙K

≥230

Heat shock resistance

ΔT

°C

800

Dielectric constant

1 МГц

6,5 ~ 7,3

Dielectric losses

1 МГц

∙10-4

≤ 4

Dielectric strength



18

Volumetric resistance

25 °C

Ом∙см

≥ 1014

Thick film

нет

Thin film



да

Application area


  • as boards for radio engineering devices working with microwave radiation. The basis for the manufacture of "traveling wave lamps";

  • substrates for solid-state emitters;

  • creation of integrated circuits for X-ray devices;

  • as a housing for heating elements;

  • substrate for ionizing radiation sensors.

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