Custom engineered design 2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish

2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish

Product Introduction

We present our 2-Layer RT/duroid 6002 PCB – a premium high-frequency circuit board engineered for demanding microwave and RF applications. Fabricated with Rogers RT/duroid 6002 ceramic-filled PTFE laminate and finished with Immersion Silver, this 0.8mm (30mil) board delivers ultra-low loss (Df 0.0012 @ 10 GHz), exceptional dielectric constant stability (Dk 2.94 ±0.04), and outstanding dimensional stability. The absence of solder mask and silkscreen, combined with the Immersion Silver finish, provides a pure, low-loss RF path ideal for phased array antennas, radar systems, and space-grade electronics.

Key Specifications

PCB Stackup (2-Layer Rigid)

Note: No blind vias – all interconnections are through-hole vias. No solder mask or silkscreen ensures minimal signal interference for critical RF paths.

PCB Statistics

Dimensions: 156 mm × 87.9 mm (1 piece)

Components: 94

Total Pads: 241 (196 thru-hole, 45 SMT on top, 0 on bottom)

Vias: 126

Nets: 2 (Simple, high-performance RF signal paths)

Why RT/duroid 6002?

RT/duroid 6002 is a ceramic-filled PTFE composite engineered for complex microwave structures requiring a low dielectric constant and ultra-low loss. Unlike standard RF laminates, it offers a remarkably low thermal coefficient of Dk (12 ppm/°C), ensuring stable performance across wide temperature swings. With a decomposition temperature (Td) of 500°C and low out-gassing characteristics, it is ideally suited for space applications and other mission-critical environments.

Key Features of RT/duroid 6002

Benefits of This RT/duroid 6002 PCB

Ultra-Low Loss: Df of 0.0012 at 10 GHz minimizes insertion loss – ideal for long RF traces and high-sensitivity receivers.

Tight Dk Control: ±0.04 tolerance ensures predictable impedance and phase matching for phased array and beamforming networks.

Temperature Stable: Low thermal coefficient of Dk (12 ppm/°C) maintains consistent performance across operating temperature ranges.

Copper-Matched CTE: In-plane expansion coefficient matched to copper – excellent dimensional stability for temperature-sensitive applications.

Low Out-Gassing: Ideal for space applications, satellite communications, and vacuum environments.

Immersion Silver Finish: Provides a flat, solderable, low-loss surface with excellent conductivity and RF transparency. No solder mask or silkscreen eliminates dielectric interference on RF traces.

Multi-Layer Ready: Excellent mechanical and electrical properties support reliable multi-layer board constructions.

Quality Assurance

100% electrical testing prior to shipment

IPC-Class-2 compliance

Full Gerber RS-274-X acceptance

ISO 9001 certified production

Typical Applications

Phased Array Antennas (military, commercial, 5G)

Ground-Based & Airborne Radar Systems

Global Positioning System (GPS) Antennas

Power Backplanes (high-frequency, low-loss)

Commercial Airline Collision Avoidance Systems (TCAS)

Beam Forming Networks

Satellite Communication Payloads

Space-Grade RF Electronics

Ordering Information

Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping.

Contact us for:

Impedance control reports

Phase matching verification

Out-gassing test data (for space applications)

Volume pricing and lead times

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. The circuit board ranges from conventional FR-4 to PTFE, metal core to flexible circuits which are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

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