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High-Frequency Jet Impingement Liquid Cooling Plate Also Commonly Referred

Categories Liquid Cooling Plate
Brand Name: Uchi
Model Number: Heat Sink
Certification: SMC
Place of Origin: Dongguan,Guangdong,China
MOQ: 100pcs
Price: 1300-1500 dollars
Payment Terms: T/T,paypal, Western Union,MoneyGram
Supply Ability: 50000000pcs per Month
Delivery Time: not limited
Application: Electronics cooling, industrial machinery, automotive
Size: 280x220x20mm
Protection Class: IP54
Extra Process: CNC Machining
Heat Source Power: 30kW
Power: 400W
Product Dimension: Can be customized
Alloy Or Not: Is Alloy
Surface Roughness: 1.2 um
Packing: PE Bag Carton
Material: Copper / Aluminum
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High-Frequency Jet Impingement Liquid Cooling Plate Also Commonly Referred

High-Frequency Jet Impingement Liquid Cooling Plate

High-Frequency Jet Impingement Liquid Cooling Plate (also commonly referred to as Jet Impingement Cold Plate) is a special liquid cooling solution for ultra-high heat flux and ultra-fast temperature uniformity. Its core mechanism is to achieve extreme heat dissipation by directly impinging the inner wall of the heating surface with high-frequency, high-speed, and high-pressure micro-jets.

I. Core Principle (Essential Difference from Traditional Flow Channels)

Traditional Liquid Cooling Plate:
Coolant flows in parallel within enclosed channels for heat exchange, featuring thick thermal boundary layer, high thermal resistance, and prone to hot spots at distant positions.
High-Frequency Jet Impingement Type:
  • Coolant passes through a dense array of micro-nozzles (diameter 0.1–1 mm)
  • Impinges vertically at high speed onto the inner wall of the cold plate (heating surface)
  • Instantly breaks the thermal boundary layer, increasing local heat transfer coefficient by 5–10 times
  • Fluid diffuses rapidly and drains laterally, achieving extremely uniform temperature across the whole area (temperature difference < ±1℃)

II. Typical Structure

  • Upper Chamber (Distribution Chamber): stabilizes pressure and distributes coolant evenly to nozzles
  • Nozzle Plate: core component with hundreds to thousands of precision micro-holes (high-frequency jet array)
  • Impingement Chamber (Heat Exchange Zone): jet impingement and intensive convective heat transfer
  • Liquid Collection Chamber / Drainage Channel: quickly discharges the heat-absorbed coolant

III. Key Technical Features

  • Extremely High Heat Dissipation Capacity
    Heat flux density: 200–1000 W/cm² (ordinary brazed plate approx. 50 W/cm²)
    Thermal resistance as low as 0.01–0.03 ℃/W
  • Excellent Temperature Uniformity
    Full-surface temperature difference: ±0.5–±1℃
    Completely eliminates local hotspots
  • Fast Response Speed
    Low thermal inertia, precise temperature control, suitable for transient high-power and pulse heating scenarios
  • Relatively High Pressure Drop
    Requires matching high-pressure pump / high-flow cooling system
  • High Manufacturing Precision Requirements
    Nozzle hole diameter, depth, and position tolerance: ±0.02–±0.05 mm

IV. Main Manufacturing Processes

  • Precision Drilling + Vacuum Brazing
    Suitable for circular hole arrays with stable mass production
    Common materials: aluminum alloy / copper alloy, brazed sealing
  • Photolithography / Etching + Diffusion Bonding
    Suitable for special-shaped nozzles and micro-scale slot jets
    Finer flow channels and lower thermal resistance (for AI/GPU/laser applications)
  • 3D Printing (SLM)
    Integrated forming with complex topological channels + nozzles
    Lightweight design, suitable for customized aerospace components

V. Application Scenarios (Extreme Thermal Management)

  • AI / Supercomputing Chips: H100/H200, GPU clusters, TPUs (>500W chips)
  • SiC / GaN Power Modules: 800V electric drives, ultra-fast charging stations
  • High-Power Lasers: fiber / semiconductor / UV lasers (heat flux > 300W/cm²)
  • Radar / Phased Array: military T/R components, 5G/6G base stations
  • Medical Imaging: MRI gradient amplifiers, CT detectors (temperature control accuracy ±0.5℃)
  • Aerospace: satellite payloads, missile guidance (vibration-resistant, lightweight, high heat flux)

VI. Comparison with Conventional Liquid Cooling Plates

PerformanceConventional Flow Channel Liquid Cooling PlateHigh-Frequency Jet Impingement Liquid Cooling Plate
Heat Flux Density< 50 W/cm²200–1000 W/cm²
Thermal Resistance0.1–0.5 ℃/W0.01–0.03 ℃/W
Temperature UniformityTemperature difference 3–10℃Temperature difference < ±1℃
Pressure DropLow (0.5–2 bar)High (2–8 bar)
Application ScenariosConventional power devicesUltra-high heat flux, hotspot-sensitive, high-precision temperature control

VII. Summary

High-Frequency Jet Impingement Liquid Cooling Plate represents the state-of-the-art liquid cooling technology in modern industry, designed specifically for extreme heat flux, ultimate temperature uniformity, and high-precision temperature control.
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