Vacuum Brazed Liquid Cold Plate Vacuum Brazed Cold Plate Heat Exchanger

Brand Name: YY Thermal

Size: Custom size

Process:Vacuum Brazing

Material:AL6063

Shape:Square

Finish:Hard anodizing

Quality control:100% test before shipping

Extra process:CNC Machining

Application:Liquid Cold Plate

Certificate:ISO 9001:2015,ISO 14001:2015

Packing:iber Optic Disc Carton,EPE,wooden pallet.

Vacuum Brazed Liquid Cold Plate

I. Core Manufacturing Principle & Process

1. Assembly

   Precisely stack the base plate with machined flow channels, brazing foil (Al‑Si, Cu‑P, etc.), and cover plate.
2. Vacuum Heating

   Place the assembly into a vacuum furnace, evacuate the air, then heat to the melting point of brazing filler metal (approx. 577℃–600℃), which is lower than the melting point of the base metal (aluminum/copper).
3. Capillary Filling

   The molten brazing filler fills all gaps between the base plate, cover plate, and internal fins via capillary action.
4. Metallurgical Bonding

   Atomic diffusion occurs between liquid brazing filler and base metal; upon cooling, it forms high-strength, high-thermal-conductivity, fully sealed integrated joints.
5. Cooling & Forming

   Slow cooling under vacuum minimizes thermal stress and ensures zero workpiece deformation.

II. Core Material Options

• Aluminum Alloy (6061/6063): Most widely used — high thermal conductivity, lightweight, low cost, and easy to machine.
• Copper (C1100/T2): Best thermal performance, ideal for ultra-high heat flux applications such as AI chips and IGBTs.
• Stainless Steel / Titanium Alloy: Used for special harsh environments requiring high corrosion and temperature resistance (aerospace, chemical industry).

III. Key Performance Advantages

• Ultra-Clean & Oxidation-Free: Vacuum environment eliminates oxidation, flux residue, porosity, and corrosion risks.
• Strong Sealing & Pressure Resistance: Monolithic structure with zero leakage; typical pressure rating 1–10 MPa.
• Extremely Low Thermal Resistance & High Efficiency: Near‑zero welding thermal resistance; combined with microchannels/fins, thermal resistance can reach as low as 0.02℃·cm²/W.
• Precise Structure & Minimal Deformation: Uniform overall heating ensures high flatness, suitable for precision electronic components.
• High Design Flexibility: Supports complex channels, multi-path layouts, microchannels (0.5 mm), embedded fins, etc.
• Long Service Life & High Reliability: Corrosion‑free and loosening‑free; industrial service life exceeds 10 years.

IV. Typical Internal Flow Channel Structures

• Single-Layer Grooved Channel: Base plate with machined grooves + cover plate; simple structure for low‑to‑medium power.
• Offset / Louvered Folded Fins: Embedded corrugated or serrated fins greatly increase heat exchange area and fluid turbulence; preferred for AI and high-performance computing.
• Skived Fin: Fins integrally cut from the base plate, eliminating contact thermal resistance for extremely high thermal conductivity.
• Microchannel Structure: 50–150 μm scale channels, heat flux > 350 W/cm², ideal for SiC/GaN power modules.

V. Main Application Fields

• AI & Data Centers: Liquid cooling plates for GPUs (NVIDIA H100/H200, A100, etc.) and server cold plates.
• New Energy Vehicles: Power battery pack cold plates, motor control units (MCU), OBC, and IGBT cooling.
• Energy Storage & Power Electronics: PCS, SVG, photovoltaic inverters, high-voltage inverters.
• Aerospace & Defense: High-reliability cooling for radar, laser equipment, and satellite payloads.
• Medical & Lasers: Precision temperature control for CT, MRI, and high-power lasers.

VI. Vacuum Brazing vs. Other Processes

VII. Summary