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AMB Technology (Active Metal Braze)

Categories Technical Ceramic Parts
Brand Name: ZG
Model Number: MS
Certification: CE
Place of Origin: China
MOQ: 1 PC
Price: 10USD/PC
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 1000 PCS
Delivery Time: 5-8 work days
Packaging Details: Strong wooden box for Global shipping
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AMB Technology (Active Metal Braze)

AMB Technology (Active Metal Braze)


AMB (Active Metal Braze) is one of the technologies that are used in the world to create boards with thick metallization (from 127 microns).


It is in the AMB technology that a solution has been found to the problem of the mismatch of the KTR of copper with a ceramic substrate, which is key in the case of DBC technology. The coordination of the KTR is achieved due to the formation of a matching layer between the conductive layer of copper and ceramics, which prevents the occurrence of internal stresses under thermal cycling conditions and is also an adhesive sublayer. A finishing coating is applied to the main metallization layer.


The main disadvantage of the technology is the presence of thermal conductivity in the matching layer, which worsens the heat removal from the conductive layer. In this connection, it is recommended to use ceramics based on aluminum nitride, because of its high thermal conductivity.


Also, bubbles may form in the intermediate connection, reducing the heat sink. It is most noticeable when applying a matching layer in the form of a special paste.


Due to the unique properties of the boards obtained by the AMB method, it becomes possible to carry out high-temperature soldering in an H2 environment. The boards have extreme thermal and energy cycle resistance (more than 15,000 power cycles in on/off mode attt=100 ° C and more than 5,000 thermal cycles at ∆t=200 ° C).

Specifications

Properties
The presence of bubbles in the solder joint< 5% от общей площади соединения (площадь 1 пузыря < 1%)
Cu thickness*, мкмот 100 до 800
CeramicsAlN, Al2O3
Adhesion, Н/мм2> 15
Cu thickness
Resolution

Distance between conductors, мм

Width of conductors, мм

Тип.

Min

Тип.

Min

0,127

0,30

0,25

0,30

0,25

0,20

0,50

0,40

0,50

0,40

0,25

0,60

0,50

0,60

0,50

0,30

0,70

0,50

0,70

0,50

0,40

0,80

0,60

0,80

0,60

Application area

  • power integrated circuits;
  • other elements of the electronic and microelectronic industry.
  • car electronics;
  • various high-power semiconductor devices and their packaging;
  • medical equipment;
  • electric locomotive power engines;
  • Microwave devices;

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