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| Categories | Rogers PCB |
|---|---|
| Place of Origin: | China |
| Certification: | ISO9001 |
| MOQ: | Negotiation |
| Price: | Negotiation |
| Payment Terms: | T/T |
| Packaging Details: | Vacuum package |
| TYPE: | Rogers printed circuit PCB |
| Layers: | 2 Layer |
| Surface Finishing: | ENIG |
| Cu Thk: | 35UM |
| Smt Efficiency: | BGA.QFP.SOP.QFN.PLCC.CHIP |
| Dielectricconstant: | 2.2 To 10.2 |
| Soldermask: | Green |
| Thermalconductivity: | 0.6 To 0.9 W/mK |
| Company Info. |
| GT SMART (Changsha) Technology Co., Limited |
| Verified Supplier |
| View Contact Details |
| Product List |
Rogers PCB refers to printed circuit boards fabricated using high-performance dielectric laminates developed and produced by Rogers Corporation, a global leader in advanced electronic materials. Unlike standard PCBs made from conventional FR-4 epoxy glass fiber, Rogers materials are specialized engineered solutions designed explicitly for high-frequency, high-speed, and high-reliability electronic applications.
Core Characteristics
Exceptional Dielectric Properties
Stable Dielectric Constant (Dk): Maintains a consistent Dk across a wide frequency range (from RF
to millimeter-wave) and varying temperatures, ensuring precise
impedance control and signal predictability.
Ultra-Low Dissipation Factor (Df): Minimizes signal attenuation
(insertion loss) and energy loss as heat, preserving signal
strength and integrity critical for high-frequency performance.
Superior Thermal & Mechanical Stability
Low Thermal Expansion: Coefficient of Thermal Expansion (CTE)
closely matches that of copper foil, reducing stress and ensuring
reliable via connections during thermal cycling.
Low Moisture Absorption: Exhibits minimal water uptake, preventing
degradation of electrical performance in humid or harsh
environments.
High Thermal Conductivity: Efficiently dissipates heat, making it
ideal for high-power RF and microwave circuits.
Common Material Series
RO4000® Series (e.g., RO4350B, RO4003C): Glass-reinforced
hydrocarbon ceramic laminates. Cost-effective with excellent RF
performance, widely used in 5G base stations, automotive radar, and
RF modules.
RO3000® Series (e.g., RO3003, RO3035): Ceramic-filled PTFE
composites. Designed for millimeter-wave applications (e.g., 77GHz
automotive radar) offering extremely low loss.
RT/duroid® Series: PTFE-based materials providing the lowest loss
for extreme high-frequency and aerospace applications.
Primary Applications
Rogers PCBs are the material of choice for mission-critical systems where performance cannot be compromised:Telecommunications: 5G/6G antennas, power amplifiers, base
stations, and microwave radio links.
Aerospace & Defense: Radar systems, satellite communications,
avionics, and electronic warfare.
Automotive: Advanced Driver Assistance Systems (ADAS), 77/79GHz
radar sensors.
Industrial & Medical: High-speed test equipment, medical imaging
(MRI), and satellite communications.
In summary, Rogers PCB represents the gold standard for
high-frequency circuit board materials, enabling the reliable
operation of cutting-edge technologies by delivering unparalleled
electrical performance and environmental stability.
| Product Name | Rogers PCB |
| Type | Hybrid Stack Up Board |
| Surface Finishing | HASL / HASL Lead Free / Immersion Gold / ENIG |
| Dielectric Constant | 2.2 to 10.2 |
| Material | Arlon 85N |
| Multilayer Stack Up | Stack Up, Control Impedance |
| SMT Efficiency | BGA, QFP, SOP, QFN, PLCC, CHIP |
| Coefficient of Thermal Expansion | 10 to 17 ppm/°C |
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