TXW550060N0
5.5" Industrial IPS Display Module
Precision optics. Industrial stamina. Clean integration.
Visual Performance
720 × RGB × 1280 native resolution. 294 PPI pixel density. Every element rendered with crisp definition — from
fine text to complex waveforms.
IPS technology delivers full viewing angle freedom. No color inversion at oblique angles. No contrast degradation
when viewed from below or the side. The panel performs identically
whether mounted horizontally in a desktop instrument or vertically
in a handheld scanner.
16.7 million colors selectable via software calibration. Smooth gradients. Accurate
skin tones in medical imaging. Precise color coding in industrial
HMI applications.
Active area: 68.04 mm × 120.96 mm
Pixel geometry: RGB stripe, 0.0945 mm × 0.0945 mm pitch
Display mode: Normally Black — deep blacks, high contrast
Environmental Endurance
Industrial displays don't live in climate-controlled offices. This
one is built for reality.
Operating temperature: -20°C to +60°C
Cold storage floors in logistics hubs. Vehicle dashboards in desert
heat. The module maintains full optical and electrical
specification across the entire span.
Storage temperature: -30°C to +80°C
Extended warehousing. Transit through extreme climates. Unpowered
survival without delamination, seal degradation, or liquid crystal
damage.
Humidity tolerance: Up to 90% RH
Coastal installations. Food processing facilities. Steam-cleaned
equipment bays. Internal electronics stay protected.
Signal Interface: MIPI DSI
Modern embedded systems demand speed and simplicity. The 4-lane MIPI DSI interface delivers both.
Differential data pairs: D0N/D0P through D3N/D3P — four independent high-speed lanes for
pixel data burst transmission
Differential clock: CLKN/CLKP — dedicated timing reference
Control signals: RST (hardware reset, active low), TE (tearing effect frame sync),
LCD_ID (module identification)
Power rails:
— VDD_3.3V for logic core
— IOV_1.8V for interface I/O
— GND planes for clean return paths
Thirty total pins. Compact FPC connector. Straightforward PCB
layout. Reduced electromagnetic interference compared to parallel
RGB alternatives. Shorter trace lengths. Simpler shielding
requirements.
Illumination System
The edge-lit LED backlight uses 15 white emitters in series electrical configuration.
Electrical characteristics:
— Forward voltage: 16.8V to 18.6V
— Typical current: 100mA
— Power input: LEDA (anode) × 4 pins, LEDK (cathode) × 4 pins
Optical output:
— Typical luminance: 1050 cd/m² with LCD stack
— Uniformity: Consistent across active area, no edge dimming or
corner falloff
Longevity:
— 20,000 hour rated life to 50% initial brightness (at 20mA per LED)
— Years of continuous operation in always-on industrial
applications
— Reduced maintenance cycles. Lower total cost of ownership.
Mechanical Design
Module envelope: 70.34 mm × 128.10 mm × 1.62 mm
The 1.62 mm thickness includes all optical layers, driver IC, and backlight assembly. No
external driver boards. No separate inverter modules. Everything
integrated into a single thin stack.
FPC tail extends from the display edge for flexible mechanical integration.
Route through hinges. Fold around internal components. Thread
through narrow chassis openings. The mechanical design adapts to
your industrial design constraints — not the reverse.
Mounting considerations:
— Non-active border areas for adhesive or bezel retention
— Seal-compatible perimeter for IP-rated enclosures
— Ground connection points for EMI compliance
Driver Architecture: ILI9881C
The ILI9881C single-chip driver integrates all display control functions.
Source driver: 720 channels — one per RGB subpixel column
Gate driver: 1280 channels — one per horizontal scan line
DC-DC converter: On-chip generation of AVDD, AVEE, and other internal bias voltages
from single 3.3V input
Gamma correction: 64-step programmable per color channel
Power management: Sleep mode, deep standby, and active states with sub-millisecond
wake transitions
Configuration storage: Internal EEPROM retains factory calibration, VCOM settings, and
power-on defaults. No external configuration required after initial
integration.
Timing and Control
Reset sequence:
— Minimum pulse width: 10 microseconds
— Reset cancel time: 5 milliseconds (standard wake), 120
milliseconds (full register reload from EEPROM)
— Mandatory 5 millisecond delay before first command after reset
release
Power sequencing:
— VDDI (I/O voltage) stable before VCI (analog core)
— Both rails stable before RESX deassertion
— LP-11 state on MIPI lanes during power-up
— >1 millisecond delay before MIPI high-speed mode entry
Tearing effect output:
— TE pin provides frame boundary synchronization
— Eliminates visual tearing in partial update scenarios
— Essential for camera viewfinder and real-time oscilloscope
applications
Reliability Verification
Every production lot undergoes environmental stress screening.
High temperature storage: 96 hours at +80°C — validates seal integrity, polarizer adhesion,
and material stability
Low temperature storage: 96 hours at -30°C — confirms cold-start capability and thermal
shock resistance
High temperature operation: 96 hours at +60°C powered — exercises driver IC, backlight, and
electrical interconnect under thermal load
Low temperature operation: 96 hours at -20°C powered — verifies liquid crystal fluidity and
response time at viscosity extremes
Humidity storage: 96 hours at 60°C / 90% relative humidity — tests moisture ingress
resistance and corrosion immunity
Thermal shock cycling: 10 complete cycles, -30°C to +80°C, 30 minute dwells — accelerates
life stress on dissimilar material interfaces
Acceptance criteria:
— Zero functional failures
— No missing segments, shorted pixels, or display anomalies
— No liquid crystal leakage
— No low-temperature bubble formation
— No end seal loosening or frame rainbow effects
Compliance & Materials
RoHS directive compliant — all materials and processing lead-free
Halogen-free options available upon request
REACH substance disclosure provided for regulatory documentation
Conflict mineral reporting supported for supply chain transparency
Integration Support
Sample availability: Engineering samples typically ship within 5 business days
Evaluation kit: Optional driver board with HDMI-to-MIPI bridge for rapid
prototyping
Mechanical samples: Non-functional units for fit-check and fixture development
Technical documentation: Full datasheet, initialization code examples, optical measurement
reports
Application engineering support: Direct access to display specialists for timing optimization,
custom gamma curves, and mechanical integration consulting.