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Professional Microfocus X Ray NDT System for PCB BGA and Electronic Assembly Analysis

Categories PCB X Ray Machine
Brand Name: WELLMAN
Model Number: X-Ray X-6800
Certification: CE,FDA,ISO9001
Place of Origin: China
Payment Terms: T/T
Packaging Details: Wooden case
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Professional Microfocus X Ray NDT System for PCB BGA and Electronic Assembly Analysis

Professional Microfocus X-Ray NDT System
Advanced non-destructive testing system for PCB BGA and electronic assembly analysis with high-precision imaging capabilities.
Working Principle
X-6800 Microfocus X-ray Inspection Equipment working principle diagram
Key Advantages
  • Closed microfocus X-ray tube: Over 10,000 hours service life, maintenance-free
  • New 5-inch high-definition digital flat panel detector
  • Detector tiltable up to 60° without losing magnification
  • One-click automatic navigation: Table moves to clicked position
  • Large 530×530 mm platform, 10 kg load capacity
  • 5-axis linkage system with adjustable speed
  • Programmable inspection process for high-volume automatic detection
  • User-friendly operation; only 2 hours training required
Hardware Specifications
ComponentParameterSpecification
X-ray SourceTypeClosed, microfocus
Max Tube Voltage90kV (110kV, 130kV optional)
Max Tube Current200μA
Focal Spot Size5μm (4μm, 2μm optional)
Flat Panel DetectorEffective Area130mm × 130mm
Pixel Size85μm
Resolution1536 × 1536
Frame Rate20fps
Tiltable Angle60°
TableSize530mm × 530mm
Detectable Area500mm × 500mm
Max Load10kg
EquipmentMagnificationGeometry 200X | System 1500X
Inspection SpeedMax 3.0s/point
Dimensions1360mm (L) × 1365mm (W) × 1730mm (H)
Weight1200kg
Power SupplyAC110-220V 50/60HZ
Max Power1500W
Industrial PCConfigurationI5 CPU, 8G RAM, 500GB SSD
Safety Features
  • Radiation leakage: ≤1 μSv/h (meets international standards)
  • Lead glass observation window for safe monitoring
  • Door/window safety interlock: X-ray cuts off when opened
  • Electromagnetic safety lock during operation
  • Emergency stop button near operation area
  • X-ray tube must be turned off before exiting software
Software Capabilities
Complete operation via keyboard and mouse with real-time status monitoring and intuitive control interface.
Function ModuleDescription
X-ray Tube ControlMouse-click activation with real-time voltage/current display and adjustable settings
Image Effect AdjustmentCustomizable brightness, contrast and gain for optimal imaging results
Product List ManagementSave and recall inspection parameters for consistent, efficient repeat inspections
Navigation WindowClick-to-move functionality for precise table positioning
Voids Rate MeasurementAutomatic calculation of solder ball voids, area, circumference with NG/OK indicators
Precision Measurement ToolsDistance, angle, radius, perimeter and area measurements with customizable parameters
Automated InspectionManual point setting, array pattern generation, and automatic feature recognition
Application Examples
BGA solder bridge inspection example
BGA Solder Bridge
BGA solder voids analysis
BGA Solder Voids
PCB through-hole inspection
PCB Through-Hole
IC voids and gold wire inspection
IC Voids and Gold Wire
LED solder voids detection
LED Solder Voids
LED gold wire crack analysis
LED Gold Wire Crack
Capacitor inspection example
Capacitor
Inductor component inspection
Inductor
Sensor inspection application
Sensor
Thyristor surge suppressors inspection
Thyristor Surge Suppressors
Fiberglass material inspection
Fiberglass
Cable inspection example
Cable
Diode component inspection
Diode
Steel pipe welding gap analysis
Steel Pipe Welding Gap
Automotive electronics inspection
Automotive Electronics
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