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Deep Pocket JEDEC Tray for Large IC Modules with Reusable Design

Categories JEDEC IC Trays
Brand Name: Hiner-pack
Model Number: HN24225
Certification: ROHS, ISO
Place of Origin: China
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Delivery Time: 10 workdays
Packaging Details: CARTON, PALLET
Tray Weight: Varies, Typically Up To 500 Grams Per Cavity
Color: Usually black or dark gray for ESD protection
Quality Assurance: Delivery Guarantee, Reliable Quality
Cavity Size: 48.5x45.5 mm
Incoterms: EXW, FOB, CIF, DDU, DDP
Mold Type: Injection
Reusable: Yes
Tray Shape: Rectangular
Clean Class: General And Ultrasonic Cleaning
Ic Type: BGA,QFP,QFN,LGA,PGA
Packing Level: Transport package
Flatness: Less than 0.76mm
Capacity: 2x5=10 PCS
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  • Product Details
  • Company Profile

Deep Pocket JEDEC Tray for Large IC Modules with Reusable Design

Deep Pocket JEDEC Tray for Large IC Modules
Ideal for large or thick semiconductor devices, ensuring secure placement.
Key Features/ Benefits
  • Deep cavity for large components
  • Strong structural support
  • Prevents damage during transport
  • Custom pocket design
Specifications
BrandHiner-pack
ModelHN24225
MaterialPPE
Package TypeJEDEC
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size322.6×135.9×10.6 mm
Cavity Size48.5x45.5 mm
Matrix QTY2x5=10 PCS
WarpageMAX 0.76mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices
  • Power modules
  • Industrial IC
  • Large semiconductor devices
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Automotive project experience
  • In-house mold design capability
  • Fast prototype development
  • Strict material control
  • Stable supply for global semiconductor customers
Buy Deep Pocket JEDEC Tray for Large IC Modules with Reusable Design at wholesale prices
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