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Special-Purpose Water Cooling Plates (Special Liquid Cooling Plates)

Categories Liquid Cooling Plate
Brand Name: Uchi
Model Number: Heat Sink
Certification: SMC
Place of Origin: Dongguan,Guangdong,China
MOQ: 100pcs
Price: 1300-1500 dollars
Payment Terms: T/T,paypal, Western Union,MoneyGram
Supply Ability: 50000000pcs per Month
Delivery Time: not limited
Process: brazed skived fin
Inspection: Calipers,CMM,Projector
Heat Dissipation Power: ≥ 100W
Flow Rate: 0 to 5L/min
Noise: 17dbA
Inletdiameter: G1/4 inch standard thread
Thermalconductivity: 400 W/m·K (for copper)
Base Material: aluminum or copper
Maxoperatingpressure: 5 bar
Working Pressure: At least 1 bar
Power: 880 W
Materials: copper + aluminum alloy
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Special-Purpose Water Cooling Plates (Special Liquid Cooling Plates)

pecial-Purpose Water Cooling Plates (Special Liquid Cooling Plates)

Special-purpose water cooling plates (special liquid cooling plates) are high-efficiency liquid cooling heat dissipation devices customized for extreme working conditions, ultra-high heat flux, stringent space constraints, or high-reliability requirements. Their core purpose is to break through the performance limits of conventional water cooling plates and solve bottleneck thermal management problems that cannot be met by ordinary heat dissipation solutions.

I. Core Definition & Technical Positioning

  • Nature: Metal baseplates (aluminum/copper/alloy) with integrated precision internal flow channels, enabling forced heat exchange via circulating coolant.
  • Special Characteristics: Non-standardized, highly customized, focusing on five key dimensions: high heat flux, high precision, high reliability, extreme environments, and special-shaped structures.
  • Core Indicators: Thermal resistance ≤ 0.05℃/W, pressure resistance ≥ 8bar, temperature difference ≤ ±3℃, suitable for heat flux at 100~1000W/cm² level.

II. Main Types & Technical Features (By Application Scenario)

1. Micro-Channel Liquid Cooling Plates (MLCP) – King of High Heat Flux

  • Structure: Embedded micron-scale flow channel network of 0.05~1mm, with channel density up to hundreds per cm².
  • Advantages: Thermal resistance as low as 0.015℃/W, heat dissipation efficiency 3~5 times that of traditional designs.
  • Process: Photolithography etching, precision brazing, 3D printing.
  • Applications: AI chips (GPU/TPU), laser devices, SiC power modules.

2. Special-Shaped / Integrated Water Cooling Plates – Ultimate Space Adaptation

  • Structure: Conformal curved surfaces, integrated multi-hole design, dual function as structural component and heat sink.
  • Process: Friction Stir Welding (FSW), die-casting, CNC milling.
  • Advantages: No splicing, excellent airtightness, lightweight.
  • Applications: Power battery packs, motor housings, aerospace avionics.

3. Extreme Environment Resistant Water Cooling Plates – For Military & Marine Use

  • Characteristics: High/low temperature resistance (-55℃~250℃), salt spray resistance (1000h+), vibration resistance (5~500Hz/5Grms).
  • Materials: Titanium alloy, stainless steel, anti-corrosion coating.
  • Applications: Shipboard electronics, radar, metallurgical equipment, polar scientific research devices.

4. Nanofluid / Two-Phase Flow Water Cooling Plates – Ultra-High Efficiency Heat Dissipation

  • Technology: Coolant doped with nanoparticles (Cu/Al₂O₃) or phase-change working fluid (fluorocarbon fluid).
  • Performance: Thermal conductivity increased by 2~3 times, heat dissipation capacity doubled.
  • Applications: MRI, supercomputers, high-power lasers.

5. Flexible / Ultra-Thin Water Cooling Plates – For Wearable & Precision Medical Devices

  • Structure: Fabric-embedded micro-flow channels, thin-film metal (thickness < 1mm).
  • Characteristics: Bendable, ultra-thin, silent.
  • Applications: VR/AR headsets, medical implants, flexible screens.

III. Core Manufacturing Processes (Special Processes)

  • Friction Stir Welding (FSW): Solder-free, high strength, excellent airtightness, suitable for large-size and high-pressure conditions.
  • Vacuum Brazing: Smooth flow channels, low thermal resistance, ideal for micro-channels and complex structures.
  • 3D Printing (SLM): Topologically optimized flow channels with 30% higher efficiency, used for customized aerospace parts.
  • Skiving / Etching: High-density fins for maximum heat exchange area, applied to AI chip cold plates.

IV. Typical Application Scenarios (Special Fields)

  • AI & Supercomputing: Direct contact cooling for GPU training clusters, suppressing hot spots and ensuring full-frequency operation.
  • New Energy Vehicles: 800V electric drives, silicon carbide modules, flash-charging battery thermal management.
  • Medical Equipment: MRI gradient amplifiers, CT detectors, with temperature control accuracy of ±0.5℃.
  • Lasers & Optoelectronics: High-power fiber/semiconductor lasers, stabilizing wavelength and output power.
  • Military & Aerospace: Radar, missile guidance systems, satellite payloads, featuring vibration resistance, radiation resistance and lightweight design.
  • Special Industry: Metallurgy, wind power converters, energy storage converters, dust and oil resistant.

V. Core Differences from Standard Water Cooling Plates

DimensionStandard Water Cooling PlatesSpecial-Purpose Water Cooling Plates
Heat Flux< 50 W/cm²100~1000 W/cm²
Thermal Resistance0.1~0.5℃/W< 0.05℃/W
MaterialsGeneral aluminum alloyCopper, CuW, titanium alloy, nano-coatings
Environmental AdaptabilityRoom temperature, normal working conditions-55~250℃, salt spray resistant, high vibration resistant
StructureStandard flat plate, simple flow channelsMicro-channels, special-shaped, integrated, ultra-thin
ReliabilityIndustrial gradeAutomotive grade, military grade, medical grade

VI. Summary

Special-purpose water cooling plates serve as the thermal management heart of high-end equipment, and are key components enabling miniaturization, high power, long service life, and stable operation under extreme environments. The core of model selection lies in four factors: heat flux density, space constraints, working conditions, and reliability level, which usually require customized development.
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