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| Categories | Alumina Ceramic Parts |
|---|---|
| Brand Name: | ZG |
| Model Number: | MS |
| Certification: | CE |
| Place of Origin: | China |
| MOQ: | 1 PC |
| Price: | 10USD/PC |
| Payment Terms: | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability: | 1000 PCS |
| Delivery Time: | 5-8 work days |
| Packaging Details: | Strong wooden box for Global shipping |
| Company Info. |
| HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
Aluminium nitride ceramic substrates (AlN)
The main advantage of substrates made on the basis of aluminum
nitride (AlN) is the high thermal conductivity, varying in the
range from 170 to 230 W/m*K. That is why AlN-based ceramics are
used in cases where it is necessary to remove significant amounts
of heat generated, for example, in cases where operating currents
are units, tens of amperes. Also, AlN has a high purity of
structure and chemical uniformity, which directly affects the
uniformity of properties. Aluminum nitride is highly inert to the
effects of almost all types of acids (with the exception of hot
mineral species).
The products are made of ceramics based on aluminum nitride AlN
according to the technical specifications
23.43.10.110-002-34576770-2016- DAYS.
Properties | Materials | |||
AlN-170 | AlN-200 | AlN-230 | ||
Colour | gray | gray | brown | |
Bulk density | г/см3 | ≥ 3,20 | ≥ 3,20 | ≥ 3,30 |
Surface roughness Ra (grinding) | мкм | 0,2 ~ 0,7 | 0,2 ~ 0,7 | 0,3 |
Surface roughness Ra (polished) | мкм | ≤ 0,05 | ≤ 0,05 | ≤ 0,05 |
Механические характеристики | ||||
Flexural strength | МПа | ≥ 380 | ≥ 380 | ≥ 350 |
Compressive strength | МПа | - | - | - |
Elastic modulus | ГПа | 320 | 320 | 320 |
Vickers Hardness | ГПа | 11 | 11 | 11 |
Fracture toughness | Мпа*м^0,5 | - | - | 2,4 |
Physical properties | ||||
Coefficient of thermal expansion (40-300°C) | 10 -6 /°C | 2,0 ~ 3,0 | 2,0 ~ 3,0 | 4,6 |
Coefficient of thermal expansion (300-800 С) | 2,5 ~ 3,5 | 2,0 ~ 3,0 | 5,2 | |
Thermal conductivity (25°C) | Вт/м∙°K | ≥ 170 | ≥ 200 | ≥ 230 |
Specific heat capacity | Дж/Кг∙°К | 720 | 720 | 720 |
Dielectric strength | ≥ 17 | ≥ 15 | ||
Volumetric resistance(25 С) | ≥ 1013 | ≥ 1013 | ≥ 1013 | |
Dielectric constant (1 МГц) | - | 8 ~ 10 | 8 ~ 10 | 8,5 |
Dielectric losses(1МГц, 25°C) | ∙10 -4 | 2 | 2 | 3 |
Sizes | ||||
Distance between scribing lines, мм | 1±0,05 | 1±0,05 | 1±0,05 | |
Minimum hole diameter, мм | 0,1±0,05 | 0,1±0,05 | 0,2±0,05 | |
Thickness, мм | 0,385 ~ 1,500 | 0,385 ~ 1,500 | 0,25 ~ 1,00 | |
Thickness tolerance (min), мм | ± 0,03 | ± 0,03 | ±10%, не менее ±0,04 мм | |
Dimensions (max), мм | 127 x 127 | 127 x 127 | 177,8 x 127 | |
Dimensional tolerance (min), мм | (+0,15 / -0,05) | (+0,15 / -0,05) | ±1%, не менее ±0,1 мм | |
Technological properties | ||||
DBC technology |
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Thick-film technology |
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Thin-film technology |
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Ceramics made on the basis of aluminum nitride ALN has a fairly wide range of applications and will allow you to effectively solve problems, regardless of the level of complexity:
a blank for ceramic printed circuit boards that require high reliability indicators;
manufacturing of substrates for semiconductors;
as a heat-absorbing element in LED circuits and high-power electronic devices;
base for high-frequency resistors and as enclosures for various circuits;
substrate for laser diodes, semiconductor crystals;
for the manufacture of sensors and other devices operated in the most difficult conditions, etc.
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