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2-layer AD300D PCB 40mil Thick with EPIG Finish

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-200.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: AD300D
Layer count: Double sided
PCB thickness: 1.2mm
PCB size: 67mm x 102.6mm per unit, +/- 0.15mm
Copper weight: 1 oz
Surface finish: EPIG (nickel free)
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2-layer AD300D PCB 40mil Thick with EPIG Finish

This double-sided PCB utilizes AD300D as its core substrate and incorporates an EPIG (nickel-free) surface finish. Configured with 1oz (1.4 mils) copper cladding on the outer layers, a finished board thickness of 1.2mm, and 20 μm via plating, the PCB delivers consistent electrical performance and high-precision manufacturing uniformity, making it highly suitable for applications including cellular infrastructure base station antennas, automotive telematics antenna systems, and commercial satellite radio antennas.


PCB Construction Details

SpecificationsDetails
Base materialAD300D
Layer countDouble sided PCB
Board dimensions67mm x 102.6mm per unit, +/- 0.15mm
Minimum Trace/Space4/6 mils
Minimum Hole Size0.4mm
Blind vias / buried viasNo Blind vias
Finished board thickness1.2mm
Finished Cu weight1 oz (1.4 mils) on outer layers
Via plating thickness20 μm
Surface finishEPIG (nickel free)
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Quality control100% Electrical test used prior to shipment

PCB Stack-up

Stack-up LayerSpecification
Copper_layer_135 μm
AD300D Core1.016 mm (40mil)
Copper_layer_235 μm

Artwork Type

The artwork provided for PCB fabrication adheres to the Gerber RS-274-X standard, the industry-accepted protocol for transmitting PCB manufacturing data.


Quality Standard

This PCB complies with the IPC-Class-2 standard, a widely recognized industry benchmark for printed circuit boards. The IPC-Class-2 standard establishes parameters for PCB quality, performance, and reliability, rendering it suitable for the majority of commercial and industrial applications requiring consistent operation and moderate dependability.


Global Availability

This PCB is available for global supply. We provide reliable logistics and shipping services to ensure the timely delivery of products to clients across various countries and regions, with the capability to accommodate the requirements of both small-batch and large-volume orders.


Introduction to AD300D Base Material

AD300D laminates are ceramic-filled, glass-reinforced PTFE-based materials engineered to offer a controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) performance. Manufactured to meet the demands of today’s wireless antenna markets, this PTFE resin-based material is compatible with standard PTFE fabrication processes and provides a cost-effective construction that enhances both electrical and mechanical performance.



Key Features of AD300D

Key FeaturesSpecifications
Dielectric Constant (Dk)2.94 at 10GHz/23°C
Dissipation Factor0.0021 at 10GHz/23°C
Coefficient of Thermal Expansion (CTE)24 ppm/°C (X-axis), 23 ppm/°C (Y-axis), 98 ppm/°C (Z-axis) (-55 to 288°C)
Thermal Coefficient of Dielectric Constant-73 ppm/°C
Flame Retardant RatingUL 94 V-0

Benefits

  • Low loss tangent (<0.002 at 10 GHz)
  • Excellent circuit performance in all typical wireless frequency bands
  • Controlled dielectric constant (±0.05) for repeatable circuit performance
  • Very low PIM (-159 dBc at 30 mil, 1900 MHz), ensuring excellent antenna performance and reduced yield loss due to PIM-related issues
  • Excellent dimensional stability, enabling repeatable circuit performance and improved manufacturing yields

Typical Applications

  • Cellular infrastructure base station antenna
  • Automotive telematics antenna Systems
  • Commercial satellite radio antenna

Conclusion

This PCB is tailored for professionals, research and development (R&D) institutions, and technology enterprises engaged in the development and manufacturing of cellular infrastructure base station antennas, automotive telematics antenna systems, and commercial satellite radio antennas. Leveraging the high-performance AD300D substrate, this PCB serves as a reliable and high-quality solution for high-demand wireless applications requiring stable electrical performance, low loss, and excellent PIM performance.


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