Semiconductor Electronics Aluminum Alloy Bonding Wire 6N High Purity 0.001mm-0.05mm
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... aluminum material. This top grade aluminum forms the core of the wire, providing it with remarkable electrical conductivity and other outstanding physical properties. Moreover, a specific proportion of carefully selected trace elements are added to this...
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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High Magnifications PCB X-ray Machine Unicomp AX9100MAX For Electronics IC Components Bonding Wire Inspection
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Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary......
Unicomp Technology
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High Accuracy Fill Dispenser Machine Dual Valve Dam Fill Dispenser For Wire Bonding
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...Wire Bonding The GS600DD is an advanced dual-valve dispensing solution crafted for the modern semiconductor packaging industry. Designed as a robust cabinet-style floor-standing unit, this system provides manufacturers with the flexibility, speed, and high accuracy demanded by today’s PCBA and high-end semiconductor......
Changzhou Mingseal Robot Technology Co., Ltd.
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Semi Automatic Wire Bonding Machine with Tin Soldering Robot and Soldering Station
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... gold/copper wire (15–75μm diameter) to connect IC chips to lead frames or PCBs via thermosonic or ultrasonic bonding, achieving ±1μm positioning accuracy for fine-pitch bonds (e.g., 25μm pitch in semiconductor packaging). Semi-Automatic Operation:...
Shenzhen Zhongtu Automation Technology Co., Ltd.
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HOREXS semiconductor ic package substrate With Chip Wire Bonding
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Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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High Precision Molds Stamped Lead Frame Copper IC Semiconductor Smd Metal Stamping
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...semiconductor smd , LED lead frame, QFP(QFJ),SOD,SOT metal frame stamping Lead frames are the metal structures inside a chip package that carry signals from the die to the outside. Leadframe for a QFP package The die inside the package is typically glued to the lead frame, and then bond wires......
Xiamen METS Industry & Trade Co., Ltd
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TR7700QM SII Smart 3D SMT AOI Machine PCB Automated Inspection Machine
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... platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced...
INFINITE AUTOMATION CO ., LIMITED
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