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0 35mm Hdi Printed Circuit Boards Burn In Testing

1-10 Results for

0 35mm hdi printed circuit boards burn in testing

from 3 Products

0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices

China 0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices on sale
... is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and are designed to withstand the hot temperatures during tests. Burn in...
Topmatch Electronics (Suzhou) Co., Limited.

Address: Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C

Rigid Flexible Printed Circuit Board , HDI PCB Design 8L3 Order HDI Plate

China Rigid Flexible Printed Circuit Board , HDI PCB Design 8L3 Order HDI Plate on sale
... thickness 0.50mm; Process structure: FR-4+TG150, minimum hole 0.35mm, copper thickness 1OZ, line width line spacing 3/3mil,Impedance Ω ± 10% Surface treatment: electric gold 1u" Quantities range from prototype to volume production. 100% E-Test Packing:...
Shenzhen Chaosheng Electronic Technology Co.,Ltd

Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong

High Precision 3.0mm Thick 8-Layer First-Order HDI Blind Hole Board FR4 HF Material OEM

China High Precision 3.0mm Thick 8-Layer First-Order HDI Blind Hole Board FR4 HF Material OEM on sale
Product Description: The Industrial Camera Prototype PCB Assembly is a cutting-edge product tailored for demanding industrial applications. This printed circuit assembly features an 8-layer PCB design for superior performance and reliability. The PCB ......
ShenZhen Jieteng Circuit Co., Ltd.

Address: Building 1, Huafeng Science and Technology Park, No. 54 Guangtian Road, Luotian County community, Songgang Town, Bao'an District, Shenzhen City

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Products: High Precision 3.0mm Thick 8-Layer First-Order HDI Blind Hole Board FR4 HF Material OEM

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