5G Phone Battery Thermal Conductive Silicone Pad , 0.5-5.0mm Thermal Conductive Gap Filler
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Thermal Conductive Silicone Pad Aluminum Battery 5G Phone 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler TIF500BS is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Thermal Conductive Silicone Pad Heatsink CPU 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler
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Thermal Conductive Silicone Pad Heatsink CPU 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting...
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF100-20-11U Electrical Insulation Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad for CPU
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... interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Heatproof Silicone Free Thermal Pad On Laptop Thickness 1mm Practical
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...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity(W/m.K) 2.0 ASTM D5470 Product feature ■ Thermal conductivity:2.0...
Shenzhen Aochuan Technology Co., Ltd
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