4L build up types 0.8mm Gold Surface IC Package Substrate
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.../Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand:SHENGYI,......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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High-Speed eMMC Memory Card with 330MB/s Read and 240MB/s Write Speeds in Compact 11.5x13x0.8mm BGA153 Package
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eMMC IC FLASH 64GBIT EMMC 153FBGA FLASH NAND Memory IC 128GB 64Gb 32GB 16GB 8G X 8 eMMC5.1 153 WFBGA 11.5x13x0.8 WHY CHOOSE US? 1.Strong research and development strength 2. Our factory has advanced packaging and testing technology 3. Complete storage ......
China Chips Star Semiconductor Co., Ltd.
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Tinplate Substrate Iron Metal Can Lids For 10L Round Industrial Chemical Paint Pail
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...Substrate Iron Metal Packaging Can Component 10L Round Industrial Chemical Paint Pail End Top Lid Pail Lid Material:Tinplate Usage: For metal can packaging Product Specification Parameter Value Cover Inner Diameter 233mm Depth 8mm Commond Material Tinplate/Substrate Iron Commond Thickness 0.28mm/0.32mm Commond Printing Process Single White Commond Peritoneal Process White Gold Film Packaging......
Delicacy packaging machinery co., ltd.
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8mmx36m PET Esd Packaging Tape Silver Gray Translucent
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... PET Tape Material: PET Size: 8mm*36m or Customized Sizes Color: Silver Gray Translucent Thickness: 0.14-0.15mm Adhesive: Single Sided Feature: ANTISTATIC Industrial use: Electronic,ESD shielding packaging raw material,IC PCB board,Factory Printing: No...
Suzhou Quanjuda Purification Technology Co., LTD
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TPS55340PWPR Power Management IC 3-V To 5.5-V Input Voltage Range
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... of ±3% - Up to 95% Efficiency - Operating Temperature Range of -40°C to 125°C - Small Footprint with 2.9mm x 3.8mm QFN Package - Low Operating Current of 1.3μA - Output Voltage Soft Start - Over-Temperature and Over-Current Protection Why buy from...
Shenzhen Sai Collie Technology Co., Ltd.
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Photometer And Photosensitive80-120mW SMD UVB LED Chip 3W 340-350nm 3.8x3.8mm
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...8mm UVB 80-120mW 3838 SMD UVB LED Chip for Photometer and Photosensitive Power 3W IF 350mA(Max=700mA) VF 4-5V Whole Size 3.8*3.8mm Dominant Wavelength 340-350nm View Angle 120° Lens Quartz Glass Lens Substrate ALN Coppering Chips Flip Chip(LG & Dowa) Warranty 10,000Hrs or 2 years Optical Power 80-120mW SMD UVB LED Chip Design Advantage: 1, Quartz glass package......
Shenzhen Learnew Optoelectronics Technology Co., Ltd.
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GOB P1.8mm P2mm P2.5mm P2.6mm Indoor Full Color LED Display SMD1515 large video screen
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...8mm P2mm P2.5mm Indoor LED Display SMD1515 High Definition Large Video Screen Wall GOB Technology Introduction New Arrival GOB technology and what's it ? GOB means Glue On Board. It is a kind of packaging technology to solve the problem of LEDs protection. It uses an advanced new transparent material to package the substrate......
Shenzhen ShiXin Display Technology Co.,Ltd
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