94 V0 1.5W/MK Heat Sink Thermal Pad Sticky Insulation Blue CPU Laptop Cooling
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...e many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. TIF100-05ES-Datasheet.pdf The TIF140-05ES is a...
Dongguan Ziitek Electronical Material and Technology Ltd.
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Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking
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...Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking The TIF™100-10E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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RoHS Ultrasoft Heat Sink Rubber Pads , 5W Silicone Thermal Pad For CPU GPU Heatsink
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Green Silicone High Thermal Conductive Pad With 5.0W/m.K For cpu thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Dark green Visual Thickness(mm) 1.0~6.0 ASTM D374 Density(g/cc) 3.2±0.1 ASTM D792 Hardness(shore ......
Shenzhen Aochuan Technology Co., Ltd
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TIF100-02F Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad
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... retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 1.5W/mK > Moldability for complex parts > Soft and...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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