CPU Thermal Gap Filler Pad TIF540US 2.95 G/Cc Cooling High Adhesive 2.6W/MK For Automotive Engine Control Units
|
CPU Silicone Rubber Thermal Gap Pad TIF540US 2.95 g/cc Cooling High Adhesive 2.6W/mK for Automotive engine control units The TIF™540US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
Ultrasoft Thermal Gap Filler Pads , Thickness 0.5 mm Heat Sink Rubber Pads
|
0.5 mm Thickness Pink Low Volume Resistivity Silicone Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + Silicone -- Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM ......
Shenzhen Aochuan Technology Co., Ltd
|
Self Tacky Thermal Gap Filler For Heat Pipe Thermal Solutions 12 Shore 00 2.9 G/Cc
|
self-tacky and High durability thermal gap filler for Heat pipe thermal solutions,12 Shore 00,2.9 g/cc Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively ......
Dongguan Ziitek Electronical Material and Technology Ltd.
|
Thermal Conductive Silicone Pad Insulating Pad for CPU Electronics
|
|
...Thermal Heat Sink Pad is engineered with a high-volume resistivity of 1x10^13 Ω·cm, making it an ideal choice for electrical insulation applications. This ensures that your electronic components remain safe and protected from electrical currents that could potentially damage them. With a 100% elongation factor built into the design, the Silica Gel Thermal gap filler......
Shenzhen Linmao Electronic Material Co.,Ltd.
|
