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2 13 G Cc Thermal Gap Filler Pad

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2 13 g cc thermal gap filler pad

from 4 Products

CPU Thermal Gap Filler Pad TIF540US 2.95 G/Cc Cooling High Adhesive 2.6W/MK For Automotive Engine Control Units

China CPU Thermal Gap Filler Pad TIF540US 2.95 G/Cc Cooling High Adhesive 2.6W/MK For Automotive Engine Control Units on sale
CPU Silicone Rubber Thermal Gap Pad TIF540US 2.95 g/cc Cooling High Adhesive 2.6W/mK for Automotive engine control units The TIF™540US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the ......
Dongguan Ziitek Electronic Materials & Technology Ltd.

Address: No.12 Xiju Road,, Hengli Township, 523460 Dongguan City

Ultrasoft Thermal Gap Filler Pads , Thickness 0.5 mm Heat Sink Rubber Pads

China Ultrasoft Thermal Gap Filler Pads , Thickness 0.5 mm Heat Sink Rubber Pads on sale
0.5 mm Thickness Pink Low Volume Resistivity Silicone Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + Silicone -- Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM ......
Shenzhen Aochuan Technology Co., Ltd

Address: 302 GuihuaRoad, GuixiangVillage, GuanlanTown, LonghuaDistrict, Shenzhen City,Guangdong Province, P.R China

Self Tacky Thermal Gap Filler For Heat Pipe Thermal Solutions 12 Shore 00 2.9 G/Cc

China Self Tacky Thermal Gap Filler For Heat Pipe Thermal Solutions 12 Shore 00 2.9 G/Cc on sale
self-tacky and High durability thermal gap filler for Heat pipe thermal solutions,12 Shore 00,2.9 g/cc Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively ......
Dongguan Ziitek Electronical Material and Technology Ltd.

Address: No.12 Xiju Road,, Hengli Township, Dongguan City, 523460 Guangdong Province, China

Thermal Conductive Silicone Pad Insulating Pad for CPU Electronics

China Thermal Conductive Silicone Pad Insulating Pad for CPU Electronics on sale
...Thermal Heat Sink Pad is engineered with a high-volume resistivity of 1x10^13 Ω·cm, making it an ideal choice for electrical insulation applications. This ensures that your electronic components remain safe and protected from electrical currents that could potentially damage them. With a 100% elongation factor built into the design, the Silica Gel Thermal gap filler......
Shenzhen Linmao Electronic Material Co.,Ltd.

Address: 201, Building A, N0.60, Xiakeng 2nd Road, Tongde Community, Baolong Street, Longgang District, Shenzhen

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