2.5g/cc CPU Ultra Soft Thermal Pad Heatproof For Laptop Cooling
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...(mm) 0.5~12.0 ASTM D374 Density(g/cc) 2.5 ASTM D792 Hardness(shore oo) 30±5 ASTM D2240 Tensile Strength(KN/m) 2.5 ASTM D624 Elongation(%) 60 ......
Shenzhen Aochuan Technology Co., Ltd
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Ultra Soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 For RDRAM Memory Modules
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...soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 RoHS compliant For RDRAM memory modules Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Heat Sink 2.2 G/Cc Silicone Thermal Pad For Memory Modules
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Moldability for complex parts Heat Sink Pad for Memory Modules, Continuos Use Temp -40 to 160℃ The TIF1140-10UF thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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