Bergquist 0.9W/m·k SIL PAD TSP K900/SP K-4 Thermal Conductive Silicon Film
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Bergquist 0.9W/m·k SIL PAD TSP K900/SP K-4 thermal conductive silicon film Product overview: Using a special Kaoton film substrate, it is a durable insulating gasket that can withstand high pressures and can completely replace thermal grease to conduct ......
SZ PUFENG PACKING MATERIAL LIMITED
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4w/MK Thermal Conductive Gap Pad UL 94-V0 For Automotive Engine Control Units
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high cost-effective thermal conductive gap pad 4w/mK, Fire rating:UL 94-V0 for automotive engine control units The TIF5160-40-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Two Part Thermal Interface Materials Blue Liquid Dispensable Thermal Gap Filler Gel
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... for a two-part, cure in place dispensable gap filler. This dispensable gap filler minimizes stress on components during assembly while providing the reliability of a traditional thermal pad. Tflex™ CR607 has been designed for reliability, intended to...
ZSUN CHIPS CO., LTD
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