Specific Gravity 2.7 G/Cc Heat Sink Thermal Pad In Mother Board
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Specific Gravity 2.7 g/cc Good thermal conductive Conductive Pads for Mother Board Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules
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Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Multipurpose silicone Heat Sink Thermal Pad practical 1.2 W/m.K
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TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 Hardness (Shore OO) 20±5 ......
Shenzhen Aochuan Technology Co., Ltd
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