TIF100-50-11US 5.0W Thermal Silicone Pad Thermal Conductive Gap Filler Silicone Pad High Conductive Silicone Thermal Pad
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...0W Thermal Silicone Pad Thermal Conductive Gap Filler Silicone Pad High Conductive Silicone Thermal Pad Product descriptions TlF100-50-11US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive 5.0W......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Thermal Interface Material 3.0W Thermal Silicone Pad For New Energy Vehicle Batteries PCB
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Thermal Interface Material 3.0W Thermal Silicone Pad For New Energy Vehicle Batteries PCB The TIFTM300 Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Factory Supply 3.0W/MK Thermal Silicone Pad For Medical Devices
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...Thermal Silicone Pad for Medical Devices The TIF300 Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive: 3.0W......
Dongguan Ziitek Electronical Material and Technology Ltd.
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High Performance 2.0W/MK Heatsink Insulation Silicone Pad Smartphone Thermal Pads Manufacturer
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Product Description: Our Thermal Conductive Pad is designed to withstand extreme temperatures, with a temperature range of -40~220℃. This makes it ideal for a variety of applications, especially those that require high-temperature resistance. The Thermal ......
Shenzhen Linmao Electronic Material Co.,Ltd.
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BERGQUIST GP3000S30 Battery Pack Gap Filled Thermally Conductive Silicon Pad 3.0W/M-K
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...Thermally Conductive silicon Pad 3.0W/m-k Product description : BERGQUIST GP3000S30 Soft thermal conductive material with substrate gap filling. Also known as GAP PAD 3000S30. The new model is GAP PAD TGP 3000. Product Features : Under very low pressure, low S-Series thermal......
SZ PUFENG PACKING MATERIAL LIMITED
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1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable
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1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Light Blue Visual Thickness(mm) 0.3~10.0 ASTM d374 Density(g/cc) 3.0 ASTM D792 Hardness......
Shenzhen Aochuan Technology Co., Ltd
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