Easily attached white thermal silicone pad TIF 100-20-06E 2w/mK silicone heatsink pads -50 to 200℃ for routers
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...thermal conductive pad TIF 100-20-06E 94 V0 2w/mK silicone heatsink pads -50 to 200℃ for routers Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter
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...Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF100-32-05U Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter
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...Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter The TIF®100-32-05U Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Practical Ultra Thin Thermal Silicone Pad , Tablets Heat Conductive Rubber Pad
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1.2W/m.K Thermal Conductivity Silicone Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 Hardness (Shore OO) ......
Shenzhen Aochuan Technology Co., Ltd
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7.3mm 2W/MK Thermal Conductive Pad For LED Lighting , Non Silicone Gap Filler Pads
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2.0W non silicone thermal interface conductive gap pad thermal gap filler LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or ......
SZ PUFENG PACKING MATERIAL LIMITED
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