Silicone Power Supply 0.5 Mm Thermal Gap Pad 3.15g/Cm3
|
|
...pads for power supply,3.15g/cm3 The TIF1120-40-11US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. TIF100-40-11US-Series-Datasheet.pdf Features > Good thermal......
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
Submit your “3 3g cm3 heat sink thermal pad” inquiry in a minute :
