Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade
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...2mm ( D * H * T) We use resin powder to increase the flexibility of cutting blades in order to supply high performace of flexible cutting for many objects. such like to Semiconductor,Optical Glass, Ceramics, Magnetic Material etc. Diamond wheel shape and...
Shaanxi Tongyu Industry And Trade Co,.Ltd
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14" Laser Welded Silent Diamond Saw Blades For Cutting Very Hard Granite
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... life The segment height is raised from 10mm to 15mm. Under the same conditions, It can cut more stone Details Specification 1. Diameter:14"/350mm 2. Segment length:40mm 3. Segment thickness:3.2mm 4. Segment height:15mm 5. Inner hole:22.23mm, 25.4mm,...
Johnson Tools Manufactory Co.,Ltd
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