4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel
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...5W/MK Thermal Conductive glue Material Conductive Epoxy Resin Potting Compound adhesive Gel Low Thermal Resistance TIETM380-45 is a one component, heatcured epoxy adhesive. lt has excellentthermal conductivity and bond strength. TIETM380-45 is a good choice for highspeed production lines because it hasthe rheology to allow stencil printing anda fast, one component, heat cure. TIE380-45-TDS_EN_REV01.4.pdf Feature > Good thermal conductive: 4.5W...
Dongguan Ziitek Electronical Material and Technology Ltd.
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Good Performance 3.0W/mk Thermally Conductive Gel For Mainboard and Mother Board
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...mk Thermally Conductive Gel For Mainboard and Mother Board Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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TIF045-11 High Thermal 4.5W Silicone Thermal Conductive Gel For Micro Heat Pipe
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...Thermal 4.5W Silicone Thermal Conductive Gel For Micro Heat Pipe Products description TIF045-11 is a soft silicone gel-based gap filler pad,formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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3.0 W/mK Thermal Conductivity Silicone Pad for Power Electronics Cooling
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... for use in a wide range of industries, including electronics, telecommunications, and automotive. The Silica Gel Thermal Insulating Pad is easy to use and install, and it is available in various sizes and thicknesses to meet your specific needs. It...
Shenzhen Linmao Electronic Material Co.,Ltd.
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TIM Thermal Cycling Stability Thermally Conductive Gel for Chip
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... material compounded with thermally conductive filler. It is through a special formula and process, the polymer silicone and excellent thermal conductivity of the filler uniformly mixed, the formation of high thermal conductivity, good thixotropy and...
Trumony Aluminum Limited
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Green Thermal Interface Materials Dispensable Gap Filler Thermal Conductive Gel
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...Thermal Gel Dispensable Gap Filler Tputty 508 Laird Single Tube 3.7W MK Product Description Laird Tputty 508 is a single part dispensable material designed with automation and vertical stability in mind. Laird has leveraged its knowledge of thermally conductive......
ZSUN CHIPS CO., LTD
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Customized Tungsten Carbide Strips 90-110 W/M·K Thermal Conductivity
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Tungsten Carbide Strips 90-110 W/M·K Thermal Conductivity Product Description: Tungsten Carbide Strips are a kind of cemented carbide strips made of tungsten carbide, which is known for its excellent thermal conductivity, high hardness, and good fracture ......
Zhuzhou Gold Sword Cemented Carbide Co., Ltd.
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5297 Two Part Addition Type Potting Adhesive 1.5 W/M·K Thermal Conductive UL94V-0, White And White Two-Color Liquid, Suitable For Potting Of Photovoltaic Inverters, LED Drive Power Supplies And Others
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5297(A7B7) TDS-EN.pdf 5297 is a 1:1 two-component addition-type potting silicone rubber, with 1.5 W /m·K thermal conductive, flame retardant. Applications All kinds of electrical components of thermal conductivity, flame retardant potting, such as ......
Shanghai Huitian New Material Co., Ltd
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0.08±0.01 W/ M·K Thermal Conductivity Battery Thermal Management System for Auto / EV
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0.08±0.01 W/ M·K Thermal Conductivity Battery Thermal Management System *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, svg {......
Fuzhou Fuqiang Precision Co., Ltd.
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7.3mm 2W/MK Thermal Conductive Pad For LED Lighting , Non Silicone Gap Filler Pads
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2.0W non silicone thermal interface conductive gap pad thermal gap filler LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or ......
SZ PUFENG PACKING MATERIAL LIMITED
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