8W/MK Silicon Thermal Pad Gap Filling Soft and Compressible for Low Stress in -45 To 200 C Environment
|
8W/MK Silicon Thermal Pad Gap Filling Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
|
8W/MK Silicon Thermal Pad Gap Filling For Mainboard/Mother Board
|
8W/MK Silicon Thermal Pad Gap Filling For Mainboard/Mother Board The TIF™700HQ Series thermally conductive interface materials are applied tofill the air gaps between the heating elements and the heat dissipation finsor the metal base.Their flexibility......
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
TIF700Q Factory Price Hot Selling Thermal Conductive Silicon Pad 8W/MK Silicone Thermal Gap Filling
|
TIF®700Q Factory Price Hot Selling Thermal Conductive Silicon Pad 8W/MK Silicone Thermal Gap Filling Product descriptions TlF®700Q is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
1W/Mk-10W/Mk Silicon Thermal Pad
|
Customized high temperature silicone rubber sheet thin silicone rubber sheet LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or ......
SZ PUFENG PACKING MATERIAL LIMITED
|
3.0 W/mK Silicone Thermal Pads for Efficient Heat Dissipation
|
... resistance to heat, cold, and other environmental factors. The pad's unique formula ensures that it can withstand extreme temperatures ranging from -60 to 200℃, making it ideal for use in various applications. The Thermal Conductive Pad is grey in...
Shenzhen Linmao Electronic Material Co.,Ltd.
|
High Temperature Silicone Thermal Pad 0.23MPa Tensile Strength For Industrial
|
Product Description: The Heat Sink Thermal Pad is available in various thicknesses ranging from 0.3mm to 15mm, making it suitable for use in a wide range of applications, including computers, LED lighting, power supplies, and other electronic devices. With......
Shenzhen Antac Technology Limited
|
0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT
|
0117 TDS-EN.pdf Product Description Silicone thermally conductive compound Gray paste Non-curing type Product Features Thermal conductivity: 4.0 W/ m·K It contains metal powder to enhance thermal conductivity and non-insulating Very small interface ......
Shanghai Huitian New Material Co., Ltd
|
3.35G/CC Silicone Thermal Pad Material Anticorrosive For EV Battery
|
8.0W/m.K Thermal Conductivity Low Volatility Silicone Thermal Pad Material For EV Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ......
Shenzhen Aochuan Technology Co., Ltd
|
Single Part DOWSIL TC-5121C Thermal Grease 2.8W/MK Pump Out Resistant Electronics Cooling
|
...Thermal Grease | Single-Part 2.8W/mK Pump-Out Resistant Electronics Cooling Basic Product Properties TC-5121 C is a single-part, non-curing thermal grease with greenish-yellow viscosity. It delivers 2.8W/mK thermal conductivity, low thermal resistance (0.09℃·cm²/W), and pump-out resistance, designed for mid-to-high-end electronics thermal......
Shenzhen Huazhisheng New Material Technology Co., Ltd.
|
Filler Gap Thermal Pad Thermal Conductivity Silicone Laird Tflex HD700
|
... deflection characteristics. The combination will allow minimal stress oncomponents while also yielding low thermal resistance. As a result, less mechanical and thermalstresses will be experienced within your device. Tflex™ HD700PI can be provided with...
ZSUN CHIPS CO., LTD
|