Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness
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... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach Chip to the laminated substrate with wire-bonding and encapsulate it by using plastic-type molding compound ,...
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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ISTA Drop Tester Laboratory Test Apparatus for Packaging Company AC220V
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...Apparatus for Packaging Company AC220V Packaging drop test is used to determine the effect of impact on the package during use, transportation, loading and unloading. The strictly designed LABTONE “1G+” ensures its accuracy. Apart from accurate plane fall test, it can also perform edge drop and corner drop test to make a complete evaluation on the performance of packaging......
Labtone Test Equipment Co., Ltd
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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High Durability Emergency Escape Breathing Apparatus Box Packaging
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15mins service time red EEBD Emergency Escape Breathing Apparatus for safety Product display Product description : The EEBD are only used for escape from a compartment that has a hazardous atmosphere to provide personnel breathing protection. Not to be ......
YOUDU (SHANGHAI) INTERNATIONAL TRADING CO.,LTD
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Slope Inclined Impact Test Apparatus For Package Carton
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Slope Inclined Impact Testing Machine for Package Carton Bevel Impact Testing Machine Model: P5200 Application: One of the most utilized pieces of shock test equipment in package testing is the Incline Impact or Conbur tester. The specialized machine ......
Infinity Machine International Inc.
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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SMT Stencil built on 0.12mm stainless steel foil Laser Cut Stainless Steel Shim for CSP Package
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Product profile 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.12mm stainless steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area ......
Shenzhen Bicheng Electronics Technology Co., Ltd
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High Efficiency 300W LED Lighting Engine 8000K Multi Chip CSP LED Module
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... LED Lighting Engine 8000K Multi Chip CSP LED Module Features: 1, Small LES,High Flux Density White LED Emitters; 2, Eutectic-bonding, CSP packaging tecnology 3, Aluminium Nitride(AIN) Ceramic substrate, high thermal conductivity; 4, High light efficiency......
GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
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