ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used
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ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used ASM NOVA Plus Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more. The Nova Plus Die Bonder / Flip Chip Bonder......
INFINITE AUTOMATION CO ., LIMITED
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Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine
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... for 180° cross-bonding. 2. Compatible with a printer to enable a variety of in-line process solutions. 3. Fully integrated carrier from loading, printing, to die bonding and...
Shenzhen Hongxinteng Technology Co., Ltd.
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High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine
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.../high Precision Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder Product name die bonding machine Solid crystal cycle >40 ms Die bonding position accuracy ±0.3 mil Dispensing heating constant temperature Resolution 0.5 um Chip ring size 6 ......
Shenzhen Wenzhan Electronic Technology Co., Ltd.
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Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
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...bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. Features: Multilayer Capability System-in-Package Capability Ultrathin Die Bonding Technology Supermini Chip......
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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SiC Ceramic Vacuum Chuck Flip-Chip Bonding Mirror Polishing High-Stiffness
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...Flip-Chip Bonding processes in semiconductor manufacturing. Its core function is to stably adsorb and secure wafers or dies during bonding, ensuring micrometer or even sub-micrometer-level alignment and interconnection...
SHANGHAI FAMOUS TRADE CO.,LTD
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Micro COB Fine Indoor 4K/8K LED Video Wall Screen Display Mature Flip-Chip Technology
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...flip-chip Mini LED COB full-color display independently designed and manufactured. Each pixel on the front of the display unit module of this series is fully flip-chip integrated and assembled, and each chip is fixed to the circuit board. On, connect the system to display the screen. Full die......
Shen Zhen AVOE Hi-tech Co., Ltd.
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UHF Short Inlay AZ 9662 Dry Inlay / Wet Inlay Alien Flip chip
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Procut Name: UHF Inlay AZ 9662 Dry Inlay / Wet Inlay Alien Flip chip Chip: Alien H3 Die Cut Size: 17mm*70mm(Flip chip) Alien Model Features Higgs-3 Meets EPCglobal™ Gen2 (V 1.2.0) as well as ISO/IEC 18000-6C 800-Bits of Nonvolatile Memory 96-EPC Bits, ......
White Smart Co., Limited
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P0.9 Small Pixel Pitch LED Display Flip-chip COB 600x337.5mm Die-casting Aliuminum
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P0.9 Small Pixel Pitch LED Display Flip-chip COB 600x337.5mm Die-casting Aliuminum Product Description: The P0.9 Small Pixel Pitch LED Display from VISUAL WORLD represents cutting-edge display technology, delivering high-definition imagery with remarkable ......
Visual World Co., Ltd.
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SMT BGA X Ray Detection Equipment Flip Chip FPD Detector 130KV For Semicon
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Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (......
Unicomp Technology
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256 Bit IC COMPONENTS XC7K410T-2FB900I FPGA IC Chip Lead free
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...Chip Product Description Cost-optimized for system I/O expansion Scalable optimized architecture, comprehensive tools and IP reuse Machine vision interfacing Product Specifications Part Number: XC7K410T-2FB900I Serial Bandwidth: 800 Gb/s PCIe Interface: X8 Gen2 RAM: 36 Kb Dual-port Block Core Voltage: 1.0V AES: 256-bit Package Options: Bare-Die Flip-Chip And HighPerformance Flip...
Shenzhen Tengshengda ELECTRIC CO., LTD.
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