4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel
|
...Conductive glue Material Conductive Epoxy Resin Potting Compound adhesive Gel Low Thermal Resistance TIETM380-45 is a one component, heatcured epoxy adhesive. lt has excellentthermal conductivity and bond strength. TIETM380-45 is a good choice for highspeed production lines because it hasthe rheology to allow stencil printing anda fast, one component, heat cure. TIE380-45-TDS_EN_REV01.4.pdf Feature > Good thermal conductive......
Dongguan Ziitek Electronical Material and Technology Ltd.
|
TIE280-12AB Thermal Conductive Glue Electronic High Thermal Conductive Potting Epoxy Resin Adhesive
|
... cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices. Features > Good thermal conductive: 1.2W/mK > Excellent insulation and smoothly sourface. > Low shrinkage > Low viscosity,...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
Epoxy Resin Adhesive Dispenser Machine for PCB with 5.7" LCD Display
|
Epoxy Resin Adhesive Dispenser Machine For PCB Specifications Epoxy resin adhesive dispenser machine for PCB 1.Easy operating 2.China Direct Supplier 3.Accurancy Application Applicable objects: Mobile phones, computer case, CD-ROM driver, printer, ink folder, PCB board, LCD, LED, DVD, digital camera, switches, connectors, relays, radiators, semiconductors, clocks, toys and medical appparutus. Glue type Silica gel, EMI conductive adhesive......
Shenzhen SMTfly Electronic Equipment Manufactory Ltd
|
Thermal Conductive Glue Electronic High Thermal Conductive Potting Epoxy Resin Adhesive
|
...life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices. TIE280-12AB-Series-Datasheet (1).pdf Features > Good thermal conductive: 1.2W/mK > Excellent insulation and smoothly sourface. > Low shrinkage >...
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
AB Glue Fast Dry Epoxy Resin Adhesive Cured Without Ripples Surface Gloss
|
... ratio) Curing time 25°C*100g*10-14 hours Description: Epoxy resin 1883AB is an epoxy resin adhesive that cures under normal and low temperature conditions. It has a high hardness, can be polished, and has a long operating time and a small amount of heat....
Chongqing Aorun Industrial Co., Ltd.
|
Main Raw Material Epoxy 5 Minute Transparent Epoxy Resin Adhesive For Woodworking
|
Main Raw Material Epoxy 5 Minute Transparent Epoxy Resin Adhesive For Woodworking Advantages Of Property Epoxy resin adhesive DY-E501 is kind of double components adhesive produced under the new environmental technology and exquisite craft, with the ......
Hunan Baxiongdi New Material Co., Ltd.
|
Epoxy Resin Adhesive Dispenser with Heating and Cleaning Functions
|
...epoxy resin adhesive glue dynamic mixing dispensing machine with heating and cleaning function Potting is a method for processing resins based on silicone, polyurethane or epoxy in liquid form to cover electrical components such as PCBs or for filling out cavities. The precise operation of metering and mixing systems is particularly important for resin casting in the electrical and electronic industries. After the curing process, the resins...
Kapudun Automation Equipment (Guangzhou)CO.,ltd
|
JGJ145-2013 Epoxy Resin Adhesive Anchoring System Ageing Resistance
|
Epoxy Resin With Strong Odor Structure And High Molecular Stability Main Performance Testing project Condition Index Gel Performance (According to China National Standard GB50728-2011) Splitting Tensile Strength (MPa) Under (23±2)℃, (50±5)%RH, tested......
ZHEJIANG XINCHOR TECHNOLOGY CO., LTD.
|
NPSN901*75 Versatile Industrial High Soluble Viscosity 25C 8000-15000 Epoxy Resin Adhesives with 75% Xylen N.V. Liquid
|
Product Details CAS No.: 1675-54-3 Main Raw Material: Bisphenol-A Usage: Construction Type: Liquid Epoxy Resin Epoxy Equivalent G/eq: 450~500 Non-volatility %: 74~76 Soluble Viscosity ( 25℃): 8000~15000 Density G/cm3 20℃: 1.10 Color (Gardner) ≤: 0-1.0 ......
Guangdong DAHUA New Material Co.,Ltd
|
EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive.
|
...Samples. OEM & ODM are Welcomed. we can do your logo and Brand EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive.Specification General performance Testing Items Units EP 3108 A B Appearance --- Colorless or ......
Shanghai Max Tech Co.,Ltd
|
