Thermal Conductive Silicone Pad Heatsink CPU 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler
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Thermal Conductive Silicone Pad Heatsink CPU 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler
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Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler TIF®800Q series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal......
Adcol Electronics (Guangzhou) Co., Ltd.
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5274 Two-Part Thermal Gel Enhanced Heat Dissipation In New Energy Vehicles With Thermal Interface Materials
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5274 TDS-EN.pdf 5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two ......
Shanghai Huitian New Material Co., Ltd
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180cc High Thermally Conductive Single Part Fillers Thermal Interface Material for LED
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...Thermally Conductive Single Part Fillers Dispensable Material for LED Discription of Thermally Conductive Single Part Fillers: Thermally Conductive Single Part Fillers is a silicone resin as the base material, adding thermally conductive fillers and bonding materials configured in a certain ratio, and processed through a special process to become a paste gap filling material......
Trumony Aluminum Limited
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TIC800P Low Melting Point Thermal Interface Materials Thermal Phase Changing Material
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...Thermal Interface Materials Thermal Phase Changing Material The TIC™800P series is low melting point thermal interface material. At 50℃, TIC™800P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
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Thermal Pad Gap Filler Silicone Free Tflex SF10 Laird Thermal Conductivity 10 W/Mk Product Description Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal......
ZSUN CHIPS CO., LTD
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Multiscene CPU Thermal Pad Material Weather Resistant Pink Color
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...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ＞6.0 ASTM D149 Dielectric Constant(@10mhz) 7.2 ASTM D150 Volume Resistivity(Ω.cm) 1012 ASTM D257 Flammability V-0 UL94 Thermal...
Shenzhen Aochuan Technology Co., Ltd
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Electronics CPU Silicone Thermal Pad Industry Thermal Interface Pad
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...Thermal Pad For Medical Equipment Field The Silicone Thermal Pad is a high quality and durable thermal interface material, specially designed for electronic components such as CPUs, GPUs, and other heat generating devices. It is made of high temperature silicone rubber, providing excellent thermal conductivity and insulation for efficient heat dissipation. Product Overview The Silicone Thermal...
Shenzhen Antac Technology Limited
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1.4W/M.K LED Thermal Interface Pad , Conductive Thermal Gap Filler Pad Reusable
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... interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal conductivity 1.0 W/M.K~6.0W/M.K 2. Thickness 0.2-20mm 3. Customized 4. Easy to install APPLICATION * Communication equipment * LED lighting *...
SZ PUFENG PACKING MATERIAL LIMITED
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