Good Thermal Conductive 2.9 G/CC CPU Thermal Pad TIF5160-30-11US 20 Shore 00
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...thermal conductive ultra soft 2.9 G/CC CPU Thermal Pad TIF5160-30-11US 20 Shore 00 RoHS compliant For CPU Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF500-30-11US Datasheet-REV02.pdf TIF5160-30-11US Series thermally...
Dongguan Ziitek Electronical Material and Technology Ltd.
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Multiscene CPU Thermal Pad Material Weather Resistant Pink Color
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...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) >6.0 ASTM D149 Dielectric Constant(@10mhz) 7.2 ASTM D150 Volume Resistivity(Ω.cm) 1012 ASTM D257 Flammability V-0 UL94 Thermal...
Shenzhen Aochuan Technology Co., Ltd
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TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK
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TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK The TIF100-20-05S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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